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Cited by
All
Since 2019
Citations
6
6
h-index
1
1
i10-index
0
0
0
4
2
2023
2024
2
4
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Seunghwan Lee
Sungkyunkwan University
Verified email at g.skku.edu
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Year
The mechanical effect of soft pad on copper chemical mechanical polishing
P Liu, Y Nam, S Lee, E Kim, S Jeon, K Park, S Hong, T Kim
Materials Science in Semiconductor Processing 155, 107256
, 2023
6
2023
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