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Co-authors
Hooman DarabiBroadcomVerified email at g.ucla.edu
Mohyee MikhemarDistinguished Engineer, Broadcom IncVerified email at broadcom.com
Mau-Chung Frank ChangUniversity of California, Los AngelesVerified email at ee.ucla.edu
Hao WuUniversity of California, Los AngelesVerified email at ucla.edu
Asad AbidiUniversity of California, Los AngelesVerified email at ee.ucla.edu
Adrian TangJet Propulsion LaboratoryVerified email at jpl.nasa.gov
Qun Jane GuUniversity of California, DavisVerified email at ucdavis.edu
Frank HsiaoUCLAVerified email at broadcom.com
Amr Amin HafezAMS Architect at Apple Inc.Verified email at ucla.edu
Hao XuFudan UniversityVerified email at ucla.edu
Frank Tinghwa WangVerified email at stanford.edu
Dihang YangUniversity of California, Los AngelesVerified email at broadcom.com
Arya BehzadGroup Vice President of Engineering, Broadcom Corp, IEEE FellowVerified email at broadcom.com
Jacob RaelVerified email at broadcom.com
Yanghyo Rod KimStevens Institute of TechnologyVerified email at stevens.edu
Sandeep D'SouzaQualcommVerified email at qti.qualcomm.com
Sai-Wang (Rocco) TamNXP Semiconductors, UCLAVerified email at ucla.edu
Weiyu LengUniversity of California Los AngelesVerified email at g.ucla.edu
Kejian ShiBroadcom Inc.Verified email at ucla.edu
Ahmadreza (Reza) RofougaranMovandi CorporationVerified email at movandi.com