| Power delivery for 3D chip stacks: Physical modeling and design implication G Huang, M Bakir, A Naeemi, H Chen, JD Meindl 2007 IEEE Electrical Performance of Electronic Packaging, 205-208, 2007 | 154 | 2007 |
| 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation MS Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ... 2008 IEEE Custom Integrated Circuits Conference, 663-670, 2008 | 136 | 2008 |
| 3-D ICs equipped with double sided power, coolant, and data features MS Bakir, G Huang US Patent 8,546,930, 2013 | 77 | 2013 |
| Co-design of signal, power, and thermal distribution networks for 3D ICs YJ Lee, YJ Kim, G Huang, M Bakir, Y Joshi, A Fedorov, SK Lim 2009 Design, Automation & Test in Europe Conference & Exhibition, 610-615, 2009 | 49 | 2009 |
| Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs L Zheng, Y Zhang, G Huang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014 | 35 | 2014 |
| Compact physical models for power supply noise and chip/package co-design of gigascale integration G Huang, DC Sekar, A Naeemi, K Shakeri, JD Meindl 2007 Proceedings 57th Electronic Components and Technology Conference, 1659-1666, 2007 | 35 | 2007 |
| Power delivery for 3-D chip stacks: Physical modeling and design implication G Huang, MS Bakir, A Naeemi, JD Meindl IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (5 …, 2012 | 28 | 2012 |
| Performance modeling for carbon nanotube interconnects in on-chip power distribution A Naeemi, G Huang, JD Meindl 2007 Proceedings 57th Electronic Components and Technology Conference, 420-428, 2007 | 22 | 2007 |
| Physical model for power supply noise and chip/package co-design in gigascale systems with the consideration of hot spots G Huang, D Sekar, A Naeemi, K Shakeri, JD Meindl 2007 IEEE Custom Integrated Circuits Conference, 841-844, 2007 | 14 | 2007 |
| 3D integrated circuits: liquid cooling and power delivery MS Bakir, G Huang, D Sekar, C King IETE Technical review 26 (6), 407-416, 2009 | 11 | 2009 |
| Compact physical models for chip and package power and ground distribution networks for gigascale integration (GSI) G Huang, A Naeemi, T Zhou, D O'Connor, A Muszynski, B Singh, ... 2008 58th Electronic Components and Technology Conference, 646-651, 2008 | 10 | 2008 |
| Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional integration systems G Huang Georgia Institute of Technology, 2008 | 5 | 2008 |
| Minimizing energy-per-bit for on-board LC transmission lines G Huang, A Naeemi, JD Meindl Proceedings of the IEEE 2005 International Interconnect Technology …, 2005 | 5 | 2005 |
| Power delivery, signaling and cooling for 2D and 3D integrated systems M Bakir, G Huang, B Dang Coupled Data Communication Techniques for High-Performance and Low-Power …, 2010 | 4 | 2010 |
| Ultracompact and high-performance 3-D integrated heterogeneous systems using microliquid cooling M Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ... IEEE Custom Integrated Circuits Conference (CICC), 2008 | 2 | 2008 |
| An approach to predicting dynamic power dissipation of coupled interconnect network in dynamic CMOS logic circuits G Huang, H Yang, R Luo, H Wang Science in China Series F: Information Sciences 45, 286-298, 2002 | | 2002 |
Azad NaeemiProfessor of Electrical and Computer Engineering, Georgia Institute of TechnologyVerified email at gatech.edu
