| 2.4GHZ Class F Power Amplifier for Wireless Medical Sensor Network JG NanSong Wu, Wei Cai Proceedings of the 2 nd World Congress on New Technologies (NewTech'16 …, 2016 | 29* | 2016 |
| Laser ultrasonic inspection of solder bumps in flip-chip packages using virtual chip package as reference C Ume, J Gong, R Ahmad, A Valdes IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 18 | 2011 |
| Non-contact microelectronic device inspection systems and methods IC Ume, A Valdes, J Gong, R Ahmad US Patent 8,661,905, 2014 | 16 | 2014 |
| Evaluation of lead-free solder bump voiding ball grid array packages using laser ultrasound and interferometric technique IC Ume, J Gong IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (8 …, 2013 | 16 | 2013 |
| Nondestructive evaluation of poor-wetted lead-free solder bumps in ball grid array packages using laser ultrasound and interferometric technique J Gong, IC Ume IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (8 …, 2012 | 15 | 2012 |
| Determining local residual stresses from high resolution wafer geometry measurements J Gong, P Vukkadala, JK Sinha, KT Turner Journal of Vacuum Science & Technology B 31 (5), 2013 | 14 | 2013 |
| Void inspection in lead-free solder bumps on ball grid array (BGA) packages using laser ultrasound technique J Gong, IC Ume ASME International Mechanical Engineering Congress and Exposition 54976, 941-948, 2011 | 9 | 2011 |
| Determination of optimum values of control parameters to reduce laser speckle noise for projection moire system S Kang, J Gong, IC Ume ASME International Mechanical Engineering Congress and Exposition 54877, 743-749, 2011 | 8 | 2011 |
| Wafer edge defect study of temporary bonded and thin wafers in TSV process flow J Gong, S Sood, R Bhat, S Jahanbin, P Aji, T Uhrmann, J Bravin, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1707-1712, 2015 | 7 | 2015 |
| Detection of poor wetting of lead-free solder bumps in ball grid array packages using laser ultrasound technique J Gong, IC Ume International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 6 | 2011 |
| Fundamental study of microelectronic chips’ response under laser excitation and signal processing methods L Yang, J Gong, IC Ume Journal of Nondestructive Evaluation 34, 1-8, 2015 | 5 | 2015 |
| Non-Destructive Evaluation of Solder Bump Quality Under Mechanical Bending Using Laser Ultrasonic Technique KA J. Gong, C. Ume Journal of Surface Mount Technology 28 (3), 15-25, 2015 | 4* | 2015 |
| Quality evaluation of solder bump in pbga package for commercial product application using laser ultrasonic technique J Gong, IC Ume, K Akinade, AR Chaudhuri ASME International Mechanical Engineering Congress and Exposition 56390 …, 2013 | 3 | 2013 |
| Fundamental study of microelectronic chip response under laser ultrasonic-interferometric inspection using C-scan method L Yang, J Gong, IC Ume AIP conference proceedings 1581 (1), 420-428, 2014 | 1 | 2014 |
| Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference RAAV I.Charles Ume, Jie Gong ASME 2010 International Mechanical Engineering Congress and Exposition 4 …, 2010 | | 2010 |
