| Plasmonic nano lithography with a high scan speed contact probe Y Kim, S Kim, H Jung, E Lee, JW Hahn Optics express 17 (22), 19476-19485, 2009 | 101 | 2009 |
| Reproducibility of sound-absorbing periodic porous materials using additive manufacturing technologies: Round robin study TG Zieliński, KC Opiela, P Pawłowski, N Dauchez, T Boutin, J Kennedy, ... Additive Manufacturing 36, 101564, 2020 | 82 | 2020 |
| Resolution limit in plasmonic lithography for practical applications beyond 2x‐nm half pitch S Kim, H Jung, Y Kim, J Jang, JW Hahn Advanced Materials 24 (44), OP337-OP344, 2012 | 50 | 2012 |
| Far-field acoustic subwavelength imaging and edge detection based on spatial filtering and wave vector conversion C Ma, S Kim, NX Fang Nature communications 10 (1), 204, 2019 | 46 | 2019 |
| Additive manufacturing of functional microarchitected reactors for energy, environmental, and biological applications S Kim, DH Kim, W Kim, YT Cho, NX Fang International Journal of Precision Engineering and Manufacturing-Green …, 2021 | 36 | 2021 |
| Sound absorption of acoustic resonators with oblique perforations J Carbajo, S Ghaffari Mosanenzadeh, S Kim, NX Fang Applied Physics Letters 116 (5), 2020 | 36 | 2020 |
| Shape-deformed mushroom-like reentrant structures for robust liquid-repellent surfaces DH Kim, S Kim, SR Park, NX Fang, YT Cho ACS Applied Materials & Interfaces 13 (28), 33618-33626, 2021 | 22 | 2021 |
| Accurate near-field lithography modeling and quantitative mapping of the near-field distribution of a plasmonic nanoaperture in a metal Y Kim, H Jung, S Kim, J Jang, JY Lee, JW Hahn Optics Express 19 (20), 19296-19309, 2011 | 21 | 2011 |
| Scalable 3D printing of aperiodic cellular structures by rotational stacking of integral image formation S Kim, JJ Handler, YT Cho, G Barbastathis, NX Fang Science Advances 7 (38), eabh1200, 2021 | 19 | 2021 |
| Microstructured surfaces for reducing chances of fomite transmission via virus-containing respiratory droplets S Kim, WY Kim, SH Nam, S Shin, SH Choi, DH Kim, H Lee, HJ Choi, ... ACS nano 15 (9), 14049-14060, 2021 | 11 | 2021 |
| Two-tier calibrated electro-optic sensing system for intense field characterization of high-power W-band gyrotron S Kim, YP Hong, JW Yang, DJ Lee Optics Express 24 (10), 10547-10555, 2016 | 11 | 2016 |
| Twin mechanical metamaterials inspired by nano-twin metals: Experimental investigations W Wu, S Kim, A Ramazani, YT Cho Composite Structures 291, 115580, 2022 | 10 | 2022 |
| Plasmonic lithography for fabricating nanoimprint masters with multi-scale patterns H Jung, S Kim, D Han, J Jang, S Oh, JH Choi, ES Lee, JW Hahn Journal of Micromechanics and Microengineering 25 (5), 055004, 2015 | 10 | 2015 |
| Field-calibrated magneto-optic sensor based on off-axis optical probing of intense magnetic fields S Kim, YP Hong, YG Kim, DJ Lee Applied Optics 56 (6), 1701-1707, 2017 | 8 | 2017 |
| Design of a contact probe with high positioning accuracy for plasmonic lithography J Jang, Y Kim, S Kim, H Jung, JW Hahn Scanning 33 (2), 99-105, 2011 | 8 | 2011 |
| Polarization insensitive electro-optic probe using birefringence-free interferometric modulation S Kim, YP Hong, DJ Lee Optics Letters 44 (11), 2895-2898, 2019 | 6 | 2019 |
| Sub-micro to nanometer scale laser direct writing techniques with a contact probe H Jung, Y Kim, S Kim, J Jang, JW Hahn International Journal of Precision Engineering and Manufacturing 12, 877-883, 2011 | 6 | 2011 |
| High‐Throughput Metal 3D Printing Pen Enabled by a Continuous Molten Droplet Transfer CK Kim, DW Cho, S Kim, SW Song, KM Seo, YT Cho Advanced Science 10 (6), 2205085, 2023 | 5 | 2023 |
| Additive manufacturing of high aspect-ratio structures with self-focusing photopolymerization M Yang, K Kowsari, NO Myrie, D Espinosa-Hoyos, A Jagielska, S Kim, ... Light: Advanced Manufacturing 3 (3), 542-571, 2022 | 5 | 2022 |
| Micro-replication platform for studying the structural effect of seed surfaces on wetting properties S Shin, SH Choi, S Baasanmunkh, S Kim, HJ Choi, YT Cho Scientific Reports 12 (1), 5607, 2022 | 5 | 2022 |
Nick FangProfessor of Mechanical Engineering, HKU (current); previous: MIT, UCLA, UIUC在 hku.hk 的电子邮件经过验证
