Machine learning and digital twin driven diagnostics and prognostics of light‐emitting diodes MS Ibrahim, J Fan, WKC Yung, A Prisacaru, W van Driel, X Fan, G Zhang
Laser & Photonics Reviews 14 (12), 2000254, 2020
47 2020 High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package A Inamdar, YH Yang, A Prisacaru, P Gromala, B Han
Polymer Degradation and Stability 188, 109572, 2021
32 2021 Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor A Palczynska, A Prisacaru, PJ Gromala, B Han, D Mayer, T Melz
2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016
25 2016 Prognostics and health monitoring of electronic system: A review A Prisacaru, PJ Gromala, MB Jeronimo, B Han, GQ Zhang
2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017
24 2017 Degradation estimation and prediction of electronic packages using data-driven approach A Prisacaru, P Gromala, B Han, GQ Zhang
IEEE transactions on industrial electronics 69 (3), 2996-3006, 2021
16 2021 A Prisacaru, A Palczynska, A Theissler, P Gromala, B Han, GQ Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018
13 2018 Accuracy of CMOS-based piezoresistive stress sensor for engineering applications of thermal loading condition: Theoretical review and experimental validation A Prisacaru, A Palczynska, P Gromala, B Wu, B Han, G Zhang
IEEE Sensors Journal 19 (20), 9139-9148, 2019
12 2019 Degradation prediction of electronic packages using machine learning A Prisacaru, EO Guerrero, PJ Gromala, B Han, GQ Zhang
2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019
12 2019 Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter B Wu, DS Kim, B Han, A Palczynska, A Prisacaru, PJ Gromala
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018
12 2018 Towards virtual twin for electronic packages in automotive applications A Prisacaru, EO Guerrero, B Chimmineni, PJ Gromala, YH Yang, B Han, ...
Microelectronics Reliability 122, 114134, 2021
9 2021 Study of thermal aging behavior of epoxy molding compound for applications in harsh environments A Inamdar, A Prisacaru, M Fleischman, E Franieck, P Gromala, A Veres, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 811-818, 2019
9 2019 Condition monitoring algorithm for piezoresistive silicon-based stress sensor data obtained from electronic control units A Prisacaru, A Palczynska, PJ Gromala, B Han, GQ Zhang
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1119-1127, 2017
9 2017 Neural networks for enhanced stress prognostics for encapsulated electronic packages-A comparison P Meszmer, M Majd, A Prisacaru, PJ Gromala, B Wunderle
Microelectronics Reliability 123, 114181, 2021
8 2021 Non-linear viscoelastic modeling of epoxy based molding compound for large deformations encountered in power modules PJ Gromala, A Prisacaru, M Jeronimo, HS Lee, Y Sun, B Han
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 834-840, 2017
7 2017 Simulation Driven Design of Novel Integrated Circuits--Physics of Failure Simulation of the Electronic Control Modules for Harsh Environment Application A Palczynska, A Sasi, M Werner, A Prisacaru, P Gromala, B Han, D Mayer, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1386-1393, 2016
5 2016 Hybrid approach to conduct failure prognostics of automotive electronic control unit B Wu, DS Kim, B Han, A Palczynska, A Prisacaru, PJ Gromala
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 476-482, 2017
4 2017 In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor YH Yang, B Han, A Prisacaru, P Gromala, S Jiang, A Sarwar
Microelectronics Reliability 110, 113650, 2020
3 2020 Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests P Meszmer, A Prisacaru, PJ Gromala, B Wunderle
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022
1 2022 EMC Oxidation Under High-Temperature Aging A Inamdar, P Gromala, A Prisacaru, A Kabakchiev, Y Yang, B Han
Reliability of Organic Compounds in Microelectronics and Optoelectronics …, 2022
1 2022 Prognostics and health management of safety relevant electronics for autonomous driving A Prisacaru
1 2021 