| Development of a lead-free composite solder from Sn–Ag–Cu and Ag-coated carbon nanotubes S Chantaramanee, S Wisutmethangoon, L Sikong, T Plookphol Journal of Materials Science: Materials in Electronics 24, 3707-3715, 2013 | 40 | 2013 |
| Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints S CHANTARAMANEE, P SUNGKHAPHAITOON Transactions of Nonferrous Metals Society of China 31 (5), 1397-1410, 2021 | 18 | 2021 |
| Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0 Sb-0.5 Cu/Cu solder joints S Chantaramanee, P Sungkhaphaitoon Microelectronics Reliability 127, 114421, 2021 | 12 | 2021 |
| Influence of indium and antimony additions on mechanical properties and microstructure of Sn-3.0 Ag-0.5 Cu lead free solder alloys S Chantaramanee, P Sungkhaphaitoon, T Plookphol Solid State Phenomena 266, 196-200, 2017 | 8 | 2017 |
| Characterization of polypropylene composites using sludge waste from the natural rubber latex industry as reinforcing filler C Homkhiew, C Srivabut, T Ratanawilai, S Rawangwong, ... Journal of Material Cycles and Waste Management 25 (3), 1444-1456, 2023 | 7 | 2023 |
| Effects of Indium Content on Microstructural, Mechanical Properties and Melting Temperature of SAC305 Solder Alloys P Sungkhaphaitoon, S Chantaramanee Russian Journal of Non-Ferrous Metals 59, 385-392, 2018 | 6 | 2018 |
| Creep of Rheocast 7075 aluminum alloy at 300 C S Thongkam, S Wisutmethangoon, J Wannasin, S Chantaramanee, ... Applied Mechanics and Materials 372, 288-291, 2013 | 5 | 2013 |
| Wettability of carbon nanotubes with molten Sn-Ag-Cu solder alloy S Chantaramanee, S Wisutmethangoon, L Sikong, T Plookphol Applied Mechanics and Materials 372, 136-142, 2013 | 5 | 2013 |
| Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7 Cu–0.05 Ni–xSb/Cu solder joints S Chantaramanee, P Sungkhaphaitoon Journal of Materials Science: Materials in Electronics 32 (23), 27607-27624, 2021 | 4 | 2021 |
| Effect of aging temperature on the microstructure and shear strength of SAC0307-0.1 Ni lead-free solders in copper joints P Sungkhaphaitoon, S Chantaramanee Russian Journal of Non-Ferrous Metals 61, 89-98, 2020 | 4 | 2020 |
| Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0 Ag-0.5 Cu Lead Free Solder on Copper Substrate S Chantaramanee, W Sriwittayakul, P Sungkhaphaitoon Materials Science Forum 928, 188-193, 2018 | 4 | 2018 |
| Elevated Temperature Tensile Behavior of Rheo-Cast 7075-T6 Al Alloy Produced by GISS Technique N Mahathaninwong, S Wisutmethangoon, T Plookphol, J Wannasin, ... Advanced Materials Research 881, 1597-1600, 2014 | 4 | 2014 |
| Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn-0.7 Ag-0.5 Cu solder alloys S Chantaramanee, P Sungkhaphaitoon Transactions of Nonferrous Metals Society of China 32 (10), 3301-3311, 2022 | 3 | 2022 |
| Comparative Study of Platinum/Single Wall Carbon Nanotube versus Platinum/Carbon Black Coating P Kalnaowakun, N Sutham, S Chantaramanee Advanced Materials Research 488, 928-933, 2012 | 1 | 2012 |
| Characterization of ceramic tile fabricated from basalt quarry dust incorporated with oil palm fiber ash D Tonnayopas, W Kaewsomboon, S Jantaramanee 19. Thaksin University annual conference 2009, Songkhla (Thailand), 24-25 …, 2009 | 1 | 2009 |
| สมบัติ ทาง กายภาพ กำลัง อัด และ โครงสร้าง ระดับ จุลภาค ของ คอนกรีต บล็อก ประสาน ปู พื้น ผสม เถ้า ไม้ไผ่ S Chantaramanee, A Hawa, C Homkhiew, N Chusilp The Journal of Industrial Technology 20 (1), 46-61, 2024 | | 2024 |
| Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3 Ag-0.7 Cu/Cu solder joint T Yordeiad, S Chantaramanee, P Sungkhaphaitoon Journal of Materials Science: Materials in Electronics 35 (1), 85, 2024 | | 2024 |
| Tensile Deformation Behavior of 6082-T6 Aluminum Alloy After Repair Welding by Metal Inert Gas Process A Sakkaeo, S Chantaramanee, P Muangjunburee, P Sungkhaphaitoon Journal of Materials Engineering and Performance 32 (22), 10204-10213, 2023 | | 2023 |
| Characterization of cement paste composites blended with palmyra fiber ash and surface-treated on short SWNT prepared by an electroless plating process S Chantaramanee, N Chusilp, C Homkhiew, D Tonnayopas | | 2022 |
| ลักษณะ วัสดุ ผสม ซีเมนต์ เพส ต์ กับ เถ้า เส้นใย ผล ตาล โตนด ใส่ ท่อ นาโน คาร์บอน ผนัง ชั้น เดียว ชนิด สั้น ผ่าน การ ปรับปรุง ผิว ภายนอก ด้วย กระบวนการ ชุบ ผิว โดย ไม่ ใช้ ไฟฟ้า S Chantaramanee, N Chusilp, C Homkhiew, D Tonnayopas RMUTP Research Journal 15 (1), 129-144, 2021 | | 2021 |
