| Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy D Le Han, YA Shen, S He, H Nishikawa Materials Science and Engineering: A 804, 140785, 2021 | 17 | 2021 |
| Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1. 0Ag0. 5Cu composite solders prepared with ultrasonic agitation F Huo, Z Jin, D Le Han, K Zhang, H Nishikawa Materials & Design 210, 110038, 2021 | 14 | 2021 |
| Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy DL Han, YA Shen, S Jin, H Nishikawa Journal of Materials Science 55 (doi.org/10.1007/s10853-020-04691-7), 10824 …, 2020 | 14 | 2020 |
| Development of a novel GTAW process for joining ultra-thin metal sheets NH Manh, H Le Duy, M Akihisa, TQ Ngoc, B Gandham Journal of Manufacturing Processes 80, 683-691, 2022 | 12 | 2022 |
| Novel interface regulation of Sn1. 0Ag0. 5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties F Huo, Z Jin, D Le Han, J Li, K Zhang, H Nishikawa Journal of Materials Science & Technology 125, 157-170, 2022 | 11 | 2022 |
| Microstructure evolution and shear strength of tin-indium-xCu/Cu joints DL Han, YA Shen, F Huo, H Nishikawa Metals 12 (1), 33, 2021 | 10 | 2021 |
| Unique characteristics of the novel-GTAW process for the butt joint of ultra-thin silicon steel sheets MH Ngo, B Gandham, DH Le, TN Van, TN Van Journal of Manufacturing Processes 85, 894-903, 2023 | 7 | 2023 |
| Successful joining of ultra-thin AA3003 aluminum alloy sheets by the novel GTAW process NH Manh, D Le Han, VA Nguyen Vacuum 207, 111558, 2023 | 7 | 2023 |
| Fabrication and characterization of nanoporous copper through chemical dealloying of cold-rolled and annealed Mn–Cu alloy B Park, D Le Han, M Saito, J Mizuno, H Nishikawa Journal of porous materials 28, 1823-1836, 2021 | 6 | 2021 |
| Relationship among welding defects with convection and material flow dynamic considering principal forces in plasma arc welding HL Nguyen, A Van Nguyen, HL Duy, TH Nguyen, S Tashiro, M Tanaka Metals 11 (9), 1444, 2021 | 6 | 2021 |
| Effect of various parameters on the shear strength of solid-state nanoporous Cu bonding in Cu–Cu disks for power device packaging B Park, DL Han, M Saito, J Mizuno, H Nishikawa Journal of Electronic Materials 51 (7), 3851-3862, 2022 | 3 | 2022 |
| Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys D Le Han, H Tatsumi, F Huo, H Nishikawa 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2148-2152, 2022 | 1 | 2022 |
| The effect of solid-state nanoporous Cu bonding for power device B Park, D le Han, M Saito, J Mizuno, H Nishikawa 2021 International Conference on Electronics Packaging (ICEP), 159-160, 2021 | 1 | 2021 |
| The electromigration study of thin-film structured Sn3. 5Ag and Ag using continuous observation and reliability enhancement approach Z Jin, F Huo, D Le Han, X Liu, H Tatsumi, YC Chan, H Nishikawa Thin Solid Films 774, 139827, 2023 | | 2023 |
| Effect of 4.0 mass% Cu addition on microstructure and mechanical properties of In-48Sn alloy D Le Han, B Park, H Nishikawa 2021 International Conference on Electronics Packaging (ICEP), 139-140, 2021 | | 2021 |
Nguyen Van AnhPhDVerified email at cranfield.ac.uk
