Monitoring microbial growth on a microfluidic lab-on-chip with electrochemical impedance spectroscopic technique S Shaik, A Saminathan, D Sharma, JA Krishnaswamy, DR Mahapatra Biomedical Microdevices 23 (2), 26, 2021 | 11 | 2021 |
Electric current induced forward and anomalous backward mass transport N Somaiah, D Sharma, P Kumar Journal of Physics D: Applied Physics 49 (20), 20LT01, 2016 | 11 | 2016 |
Fracture of pre-cracked metallic conductors under combined electric current and mechanical loading D Sharma, BS Reddy, P Kumar International Journal of Fracture 212, 167-182, 2018 | 7 | 2018 |
Tailoring energy absorption capacity of CNT forests through application of electric field P Jagtap, SK Reddy, D Sharma, P Kumar Carbon 95, 126-136, 2015 | 7 | 2015 |
Fracture of pre-cracked thin metallic conductors due to electric current induced electromagnetic force D Sharma, BS Reddy, P Kumar International Journal of Fracture 212, 183-204, 2018 | 5 | 2018 |
Two-phase metallic thermal interface materials processed through liquid phase sintering followed by accumulative roll bonding D Sharma, RK Tiwari, R Sharma, PR Narayanan, P Kumar IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 5 | 2015 |
Failure of thin metallic conductors under electric current loading: Transition from sharp crack to blow-hole D Sharma, P Kumar Engineering Fracture Mechanics 208, 221-237, 2019 | 4 | 2019 |
On the inter-layer magneto-electric coupling in BiFeO3/SrRuO3 heterostructure A Sil, AA Wagh, D Sharma, R Ranjan, PS Anil Kumar Applied Physics Letters 111 (10), 2017 | 2 | 2017 |
A technique for machining thin metallic foils using electromagnetic-mechanical pulsed loading D Sharma, I Dutta, P Kumar Engineering Research Express 2 (1), 015031, 2020 | 1 | 2020 |
Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material D Sharma, A Jain, N Somaiah, PR Narayanan, P Kumar Journal of Electronic Materials 47, 4863-4874, 2018 | | 2018 |