Discrete electronic component arrangement including anchoring, thermally conductive pad CK Nah, MD Stillabower, B Pan, SY Yong, P Gromala
US Patent 7,148,554, 2006
41 2006 High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package A Inamdar, YH Yang, A Prisacaru, P Gromala, B Han
Polymer Degradation and Stability 188, 109572, 2021
32 2021 Internal stress state measurements of the large molded electronic control units P Gromala, S Fischer, T Zoller, A Andreescu, J Duerr, M Rapp, J Wilde
2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013
26 2013 Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor A Palczynska, A Prisacaru, PJ Gromala, B Han, D Mayer, T Melz
2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016
25 2016 Prognostics and health monitoring of electronic system: A review A Prisacaru, PJ Gromala, MB Jeronimo, B Han, GQ Zhang
2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017
24 2017 Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions B Wu, DS Kim, B Han, A Palczynska, PJ Gromala
2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015
22 2015 In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor A Palczynska, PJ Gromala, D Mayer, B Han, T Melz
2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015
21 2015 Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application P Gromala, B Muthuraman, B Öztürk, KMB Jansen, L Ernst
2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015
17 2015 Degradation estimation and prediction of electronic packages using data-driven approach A Prisacaru, P Gromala, B Han, GQ Zhang
IEEE transactions on industrial electronics 69 (3), 2996-3006, 2021
16 2021 Electronic control package model calibration using moiré interferometry DS Kim, B Han, A Yadur, PJ Gromala
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014
16 2014 Cure dependent characterisation of moulding compounds KMB Jansen, M Hawryluk, P Gromala
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011
14 2011 Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving M Hager, P Gromala, B Wunderle, S Rzepka
Advanced Microsystems for Automotive Applications 2018: Smart Systems for …, 2019
13 2019 Failure Detection of Electronic Control Units Using Piezoresistive Stress SensorA Prisacaru, A Palczynska, A Theissler, P Gromala, B Han, GQ Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018
13 2018 Prognostic approaches for the wirebond failure prediction in power semiconductors: A case study using DPAK package P Gromala, A Palczynska, B Han
2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015
13 2015 Volumetric effective cure shrinkage measurement of dual curable adhesives by fiber Bragg grating sensor SP Phansalkar, C Kim, B Han, PJ Gromala
Journal of materials science 55 (22), 9655-9664, 2020
12 2020 Accuracy of CMOS-based piezoresistive stress sensor for engineering applications of thermal loading condition: Theoretical review and experimental validation A Prisacaru, A Palczynska, P Gromala, B Wu, B Han, G Zhang
IEEE Sensors Journal 19 (20), 9139-9148, 2019
12 2019 Degradation prediction of electronic packages using machine learning A Prisacaru, EO Guerrero, PJ Gromala, B Han, GQ Zhang
2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019
12 2019 Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter B Wu, DS Kim, B Han, A Palczynska, A Prisacaru, PJ Gromala
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018
12 2018 Comprehensive material characterization and method of its validation by means of FEM simulation P Gromala, J Duerr, M Dressler, KMB Jansen, M Hawryluk, J De Vreugd
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011
12 2011 Towards virtual twin for electronic packages in automotive applications A Prisacaru, EO Guerrero, B Chimmineni, PJ Gromala, YH Yang, B Han, ...
Microelectronics Reliability 122, 114134, 2021
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