| 3-d heterogeneous integration of rram-based compute-in-memory: Impact of integration parameters on inference accuracy A Kaul, Y Luo, X Peng, M Manley, YC Luo, S Yu, MS Bakir IEEE Transactions on Electron Devices 70 (2), 485-492, 2022 | 5 | 2022 |
| H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention W Li, M Manley, J Read, A Kaul, MS Bakir, S Yu IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2023 | 2 | 2023 |
| Thermal Modeling of 2.5 D Integrated Package of CMOS Image Sensor and FPGA for Autonomous Driving J Sharda, M Manley, A Kaul, W Li, M Bakir, S Yu 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2023 | 1 | 2023 |
| Artificial Neuron using Ag/2D-MoS2/Au Threshold Switching Memristor D Dev, A Krishnaprasad, Z He, S Das, MS Shawkat, M Manley, O Aina, ... 2019 Device Research Conference (DRC), 193-194, 2019 | 1 | 2019 |
| Design and Thermal Analysis of 2.5 D and 3D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving J Sharda, M Manley, A Kaul, W Li, M Bakir, S Yu IEEE Journal of the Electron Devices Society, 2024 | | 2024 |
| Design Considerations for Power Delivery Network and Metal-Insulator-Metal Capacitor Integration in Bridge-Chips for 2.5-D Heterogeneous Integration A Kaul, MO Hossen, M Manley, MS Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 985-990, 2023 | | 2023 |
| Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader A Victor, M Manley, S Oh, MS Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1767-1772, 2023 | | 2023 |
| Towards Selective Cobalt Atomic Layer Deposition for Chip-to-Wafer 3D Heterogeneous Integration M Manley, ZJ Devereaux, V Wang, C Kuo, NMK Linn, A Kummel, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 374-378, 2023 | | 2023 |
| Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation T Zheng, M Manley, M Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1493-1498, 2023 | | 2023 |
| Stochasticity in an Artificial Neuron using Ag/2D-MoS2/Au Threshold Switching Memristor M Manley | | 2019 |
