| Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV) X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman Electronic Components and Technology Conference, 624-629, 2009 | 216 | 2009 |
| Progressive failure analysis of bonded composite repairs X Liu, G Wang Composite structures 81 (3), 331-340, 2007 | 201 | 2007 |
| A PDMS-Based Integrated Stretchable Microelectrode Array (isMEA) for Neural and Muscular Surface Interfacing L Guo, GS Guvanasen, X Liu, C Tuthill, TR Nichols, SP DeWeerth IEEE Transactions on Biomedical Circuits and Systems 7 (1), 1-10, 2013 | 142 | 2013 |
| Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test X Liu, Q Chen, V Sundaram, RR Tummala, SK Sitaraman Microelectronics Reliability 53, 70-78, 2013 | 83 | 2013 |
| Extracellular matrix-based intracortical microelectrodes: Toward a microfabricated neural interface based on natural materials W Shen, L Karumbaiah, X Liu, T Saxena, S Chen, R Patkar, ... Microsystems & Nanoengineering 1, 15010, 2015 | 62 | 2015 |
| Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC M Jung, X Liu, SK Sitaraman, DZ Pan, SK Lim Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on …, 2011 | 48 | 2011 |
| Democratizing digital design and manufacturing using high performance cloud computing: Performance evaluation and benchmarking D Wu, X Liu, S Hebert, W Gentzsch, J Terpenny Journal of Manufacturing Systems 43, 316-326, 2017 | 36 | 2017 |
| Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies Y Tian, J Chow, X Liu, YP Wu, SK Sitaraman Journal of Electronic Materials 42 (2), 230-239, 2013 | 34 | 2013 |
| Thermo-mechanical behavior of through silicon vias in a 3D integrated package with inter-chip microbumps X Liu, Q Chen, V Sundaram, M Simmons-Matthews, KP Wachtler, ... Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1190 …, 2011 | 34 | 2011 |
| Reliability assessment of through-silicon vias in multi-die stack packages X Liu, Q Chen, V Sundaram, M Simmons-Matthews, KP Wachtler, ... IEEE Transactions on Device and Materials Reliability 12 (2), 263-271, 2012 | 30 | 2012 |
| In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation X Liu, PA Thadesar, CL Taylor, H Oh, M Kunz, N Tamura, MS Bakir, ... Applied Physics Letters 105 (11), 112109, 2014 | 26 | 2014 |
| Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ... Applied Physics Letters 103 (2), 022107, 2013 | 26 | 2013 |
| Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ... Journal of Applied Physics 114 (6), 064908, 2013 | 21 | 2013 |
| Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies Y Tian, X Liu, J Chow, YP Wu, SK Sitaraman Microelectronics Reliability 54 (5), 939–944, 2014 | 20 | 2014 |
| Experimental and Simulation Study of Double-Sided Flip-Chip Assembly with a Stiffener Ring X Liu, M Li, D Mullen, J Cline, S Sitaraman Device and Materials Reliability, IEEE Transactions on 14, 512-522, 2014 | 17 | 2014 |
| Reliable design of electroplated copper through silicon vias X Liu, Q Chen, V Sundaram, S Muthukumar, RR Tummala, SK Sitaraman International Mechanical Engineering Congress and Exposition (IMECE), 2010 | 17 | 2010 |
| Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies Y Tian, X Liu, J Chow, YP Wu, SK Sitaraman Journal of Electronic Materials 42 (8), 2724-2731, 2013 | 16 | 2013 |
| Design and assembly of a double-sided 3D package with a controller and a DRAM stack X Liu, M Li, D Mullen, J Cline, SK Sitaraman 2012 IEEE 62nd Electronic Components and Technology Conference, 1205-1212, 2012 | 12 | 2012 |
| The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies Y Tian, J Chow, X Liu, SK Sitaraman Soldering & Surface Mount Technology 27 (4), 178-184, 2015 | 10 | 2015 |
| Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (7 …, 2016 | 8 | 2016 |
