| Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections PA Kohl, Q Zhao, SAB Allen US Patent 6,165,890, 2000 | 206 | 2000 |
| Functionalized polynorbornene dielectric polymers: adhesion and mechanical properties NR Grove, PA Kohl, SA Bidstrup Allen, S Jayaraman, R Shick Journal of Polymer Science Part B: Polymer Physics 37 (21), 3003-3010, 1999 | 185 | 1999 |
| Plasma‐Enhanced Chemical Vapor Deposition of Silicon Dioxide Deposited at Low Temperatures Ceiler, Kohl, Bidstrup Journal of the Electrochemical Society, 1995 | 163 | 1995 |
| Silver metallization for advanced interconnects R Manepalli, F Stepniak, SA Bidstrup-Allen, PA Kohl IEEE transactions on advanced packaging 22 (1), 4-8, 1999 | 154 | 1999 |
| Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications D Bhusari, HA Reed, M Wedlake, AM Padovani, SAB Allen, PA Kohl Journal of Microelectromechanical Systems 10 (3), 400-408, 2001 | 151 | 2001 |
| Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors S Ogitani, SA Bidstrup-Allen, PA Kohl IEEE transactions on advanced packaging 23 (2), 313-322, 2000 | 142 | 2000 |
| Fabrication of microchannels using polycarbonates as sacrificial materials HA Reed, CE White, V Rao, SAB Allen, CL Henderson, PA Kohl Journal of Micromechanics and Microengineering 11 (6), 733, 2001 | 133 | 2001 |
| Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates JP Jayachandran, HA Reed, H Zhen, LF Rhodes, CL Henderson, ... Journal of Microelectromechanical Systems 12 (2), 147-159, 2003 | 125 | 2003 |
| Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures S Agraharam, DW Hess, PA Kohl, SA Bidstrup Allen Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17 (6 …, 1999 | 102 | 1999 |
| Underfill of flip chip on laminates: simulation and validation L Nguyen, C Quentin, P Fine, B Cobb, S Bayyuk, H Yang, ... IEEE Transactions on Components and Packaging Technologies 22 (2), 168-176, 1999 | 97 | 1999 |
| Biodegradable magnesium/iron batteries with polycaprolactone encapsulation: A microfabricated power source for transient implantable devices M Tsang, A Armutlulu, AW Martinez, SAB Allen, MG Allen Microsystems & Nanoengineering 1 (1), 1-10, 2015 | 92 | 2015 |
| Fabrication of semiconductor device with air gaps for ultra low capacitance interconnections and methods of making same PA Kohl, SAB Allen, CL Henderson, HA Reed, DM Bhusari US Patent 6,610,593, 2003 | 89 | 2003 |
| Fabrication of semiconductor device with air gaps for ultra low capacitance interconnections and methods of making same PA Kohl, SAB Allen, CL Henderson, HA Reed, DM Bhusari US Patent 6,610,593, 2003 | 89 | 2003 |
| Stresses in Thin Film Metallization Hodge, Bidstrup-Allen, Kohl | 87 | 1997 |
| Estimated number of cases of high-grade cervical lesions diagnosed among women—United States, 2008 and 2016 NM McClung MMWR. Morbidity and mortality weekly report 68, 2019 | 80 | 2019 |
| Modeling the Properties of PECVD Silicon Dioxide Films Using Optimized Back-Propagation Neural Networks Han, Ceiler, Bidstrup, Kohl, May Components, Packaging, and Manufacturing Technology, 1994 | 80 | 1994 |
| Chemorheology Relations for Epoxy-Amine Crosslinking SA Bidstrup, CW Macosko Journal of Polymer Science: Polymer Physics Edition 28 (5), 691-709, 1990 | 78 | 1990 |
| Increased prevalence and geographic spread of the cardiopulmonary nematode Angiostrongylus vasorum in fox populations in Great Britain CS Taylor, RG Gato, J Learmount, NA Aziz, C Montgomery, H Rose, ... Parasitology 142 (9), 1190-1195, 2015 | 77 | 2015 |
| Air‐Gaps for Electrical Interconnections PA Kohl, Q Zhao, K Patel, D Schmidt, SA Bidstrup-Allen, R Shick, ... Electrochemical and Solid-State Letters 1 (1), 49, 1998 | 77 | 1998 |
| Processing Effects on Optical Anisotropy in Spin Coated Polyimide Films L Lin, SA Bidstrup Journal of Applied Polymer Science 49, 1277-1289, 1993 | 74 | 1993 |
Clifford L. HendersonDean of Engineering, Professor of Chemical and Biological Engineering, The University of AlabamaVerified email at ua.edu
