| Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding MS Goorsky, K Schjølberg-Henriksen, B Beekley, T Bai, K Mani, ... Japanese Journal of Applied Physics 57 (2S1), 02BC03, 2017 | 11 | 2017 |
| Interface evolution of au-au thermocompression bonding and nanotwins B Beekley University of California, Los Angeles, 2015 | 3 | 2015 |
| Selective-area growth of heavily n–doped GaAs nanostubs on Si (001) by molecular beam epitaxy YJ Chang, PJ Simmonds, B Beekley, MS Goorsky, J Woo Applied Physics Letters 108 (16), 2016 | 2 | 2016 |
| The synergistic roles of temperature and pressure in thermo-compression bonding of Au P Ambhore, K Mani, B Beekley, N Malik, K Schjølberg-Henriksen, S Iyer, ... ECS Transactions 86 (5), 129, 2018 | 1 | 2018 |
| Low temperature metal-metal bonding for heterogeneous integration and performance scaling MS Goorsky, K Schjolberg-Henriksen, B Beekley, N Marathe, K Mani, ... 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | | 2017 |
| The stability of metallized, thin, flexible III–V structures for high temperature applications and wafer bonding T Bai, B Beekley, M Jackson, MS Goorsky 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC), 1-3, 2015 | | 2015 |
| Large Area Plan-View Transmission Electron Microscopy Sample Preparation for Direct-Bonded Interfaces B Beekley, CR Roberts, MS Salazar, MS Goorsky ECS Transactions 64 (5), 161, 2014 | | 2014 |
| Selective-Area Growth of Heavily n-Doped c-GaN/GaAs Nanostubs on Si (100) Substrate by Molecular Beam Epitaxy YJ Chang, B Beekley, MS Goorsky, JCS Woo | | |
