| Photo-catalytic preparation of silver-coated TiO2 particles for antibacterial applications J Keleher, J Bashant, N Heldt, L Johnson, Y Li World Journal of Microbiology and Biotechnology 18, 133-139, 2002 | 199 | 2002 |
| Hydroxyl Radical Formation in H 2 O 2‐Amino Acid Mixtures and Chemical Mechanical Polishing of Copper M Hariharaputhiran, J Zhang, S Ramarajan, JJ Keleher, Y Li, SV Babu Journal of the Electrochemical Society 147 (10), 3820, 2000 | 171 | 2000 |
| Diamond slurry for chemical-mechanical planarization of semiconductor wafers Y Li, DB Cerutti, DJ Buckley Jr, ER Tyre Jr, JJ Keleher, RJ Uriarte, ... US Patent 6,258,721, 2001 | 70 | 2001 |
| Silica-based slurry SD Hellring, CP McCann, CF Kahle, Y Li, J Keleher US Patent 6,656,241, 2003 | 47 | 2003 |
| Synthesis and characterization of a chitosan/PVA antimicrobial hydrogel nanocomposite for responsive wound management materials SJ Rinehart, TD Campbell, KJ Burke, B Garcia, A Mlynarski, SJ Brain, ... J. Microb. Biochem. Technol 8 (02), 2016 | 39 | 2016 |
| Chemical mechanical polishing composition and method Y Li, J Keleher, J Zhao, C Brancewicz US Patent App. 10/292,404, 2004 | 36 | 2004 |
| Metal-passivating CMP compositions and methods J Keleher, P Singh, V Brusic US Patent 8,435,421, 2013 | 32 | 2013 |
| Diamond slurry for chemical-mechanical planarization of semiconductor wafers Y Li, DB Cerutti, DJ Buckley Jr, ER Tyre Jr, JJ Keleher, RJ Uriarte, ... US Patent 6,242,351, 2001 | 32 | 2001 |
| A biomimetic cellulose‐based composite material that incorporates the antimicrobial metal‐organic framework HKUST‐1 TA Rickhoff, E Sullivan, LK Werth, DS Kissel, JJ Keleher Journal of Applied Polymer Science 136 (3), 46978, 2019 | 26 | 2019 |
| Evaluation of the catalytic decomposition of H2O2 through use of organo-metallic complexes–A potential link to the luminol presumptive blood test TJ Soderquist, OM Chesniak, MR Witt, A Paramo, VA Keeling, JJ Keleher Forensic science international 219 (1-3), 101-105, 2012 | 26 | 2012 |
| Relationship between molecular structure and removal rates during chemical mechanical planarization: comparison of benzotriazole and 1, 2, 4-triazole KL Stewart, JJ Keleher, AA Gewirth Journal of The Electrochemical Society 155 (10), D625, 2008 | 19 | 2008 |
| Compositions and methods for CMP of low-k-dielectric materials J Keleher, D Woodland, FDR Thesauro, R Medsker, J Aggio US Patent 7,456,107, 2008 | 17 | 2008 |
| Method of fabricating a copper damascene structure Y Li, J Keleher US Patent 6,660,639, 2003 | 16* | 2003 |
| Development of “soft” cleaning chemistries for enhanced STI post-CMP cleaning CF Graverson, KM Wortman-Otto, AN Linhart, TB Zubi, JJ Keleher ECS Transactions 92 (2), 165, 2019 | 14 | 2019 |
| Key chemical components in metal CMP slurries K Cheemalapati, J Keleher, Y Li Microelectronic Applications of Chemical Mechanical Planarization, Wiley …, 2007 | 14 | 2007 |
| Slurry for chemical-mechanical polishing copper damascene structures Y Li, J Keleher US Patent 6,508,953, 2003 | 12 | 2003 |
| Role of Molecular Structure on Modulating the Interfacial Dynamics for Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Applications KM Wortman-Otto, AN Linhart, AL Dudek, BM Sherry, JJ Keleher ECS Journal of Solid State Science and Technology 10 (2), 024009, 2021 | 10 | 2021 |
| Striking a balance: Role of supramolecular assemblies on the modulation of the chemical and mechanical contributions during Post-STI CMP cleaning CF Graverson, KM Wortman-Otto, AN Linhart, Y Sampurno, A Philipossian, ... Materials Chemistry and Physics 259, 124170, 2021 | 10 | 2021 |
| Copper-passivating CMP compositions and methods D White, J Keleher, J Parker US Patent 7,955,520, 2011 | 8 | 2011 |
| Copper CMP composition containing ionic polyelectrolyte and method D White, J Keleher, J Parker | 8 | 2009 |
