| Benchmarking monolithic 3D integration for compute-in-memory accelerators: overcoming ADC bottlenecks and maintaining scalability to 7nm or beyond X Peng, W Chakraborty, A Kaul, W Shim, MS Bakir, S Datta, S Yu 2020 IEEE International Electron Devices Meeting (IEDM), 30.4. 1-30.4. 4, 2020 | 17 | 2020 |
| Heterogeneous 3-D integration of multitier compute-in-memory accelerators: An electrical-thermal co-design X Peng, A Kaul, MS Bakir, S Yu IEEE Transactions on Electron Devices 68 (11), 5598-5605, 2021 | 15 | 2021 |
| Beol-embedded 3d polylithic integration: Thermal and interconnection considerations A Kaul, SK Rajan, MO Hossen, GS May, MS Bakir 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1459-1467, 2020 | 14 | 2020 |
| Microfluidic cooling of a 14-nm 2.5-D FPGA with 3-D printed manifolds for high-density computing: Design considerations, fabrication, and electrical characterization TE Sarvey, A Kaul, SK Rajan, A Dasu, R Gutala, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 10 | 2019 |
| Monolithic microfluidic cooling of a heterogeneous 2.5-D FPGA with low-profile 3-D printed manifolds SK Rajan, A Kaul, TE Sarvey, GS May, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 7 | 2021 |
| 3-D heterogeneous integration of rram-based compute-in-memory: Impact of integration parameters on inference accuracy A Kaul, Y Luo, X Peng, M Manley, YC Luo, S Yu, MS Bakir IEEE Transactions on Electron Devices 70 (2), 485-492, 2022 | 5 | 2022 |
| A compute-in-memory hardware accelerator design with back-end-of-line (BEOL) transistor based reconfigurable interconnect Y Luo, S Dutta, A Kaul, SK Lim, M Bakir, S Datta, S Yu IEEE Journal on Emerging and Selected Topics in Circuits and Systems 12 (2 …, 2022 | 5 | 2022 |
| Monolithic 3D compute-in-memory accelerator with BEOL transistor based reconfigurable interconnect Y Luo, S Dutta, A Kaul, S Lim, M Bakir, S Datta, S Yu 2021 IEEE International Electron Devices Meeting (IEDM), 25.3. 1-25.3. 4, 2021 | 5 | 2021 |
| Thermal reliability considerations of resistive synaptic devices for 3D CIM system performance A Kaul, Y Luo, X Peng, S Yu, MS Bakir 2021 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2021 | 5 | 2021 |
| Power delivery and thermal-aware arm-based multi-tier 3D architecture L Zhu, T Ta, R Liu, R Mathur, X Xu, S Das, A Kaul, A Rico, D Joseph, ... 2021 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2021 | 5 | 2021 |
| Design Considerations, Demonstration, and Benchmarking of Silicon Microcold Plate and Monolithic Microfluidic Cooling for 2.5 D ICs SK Rajan, A Kaul, T Sarvey, GS May, MS Bakir 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1418-1426, 2021 | 5 | 2021 |
| Thermal modeling of 3D polylithic integration and implications on BEOL RRAM performance A Kaul, X Peng, SK Rajan, S Yu, MS Bakir 2020 IEEE International Electron Devices Meeting (IEDM), 13.1. 1-13.1. 4, 2020 | 4 | 2020 |
| Modeling and simulation of an HVAC system for energy analysis and management of commercial buildings A Sreedevi, A Kaul, K Radhika International Conference on Circuits, Communication, Control and Computing …, 2014 | 4 | 2014 |
| H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention W Li, M Manley, J Read, A Kaul, MS Bakir, S Yu IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2023 | 2 | 2023 |
| Analysis of power delivery network (pdn) in bridge-chips for 2.5-d heterogeneous integration MO Hossen, A Kaul, E Nurvitadhi, MD Pant, R Gutala, A Dasu, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 2 | 2022 |
| A model study of multilevel signaling for high-speed chiplet-to-chiplet communication in 2.5 D integration R Saligram, A Kaul, MS Bakir, A Raychowdhury 2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration …, 2020 | 2 | 2020 |
| Thermal Modeling of 2.5 D Integrated Package of CMOS Image Sensor and FPGA for Autonomous Driving J Sharda, M Manley, A Kaul, W Li, M Bakir, S Yu 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2023 | 1 | 2023 |
| Electrical and performance benefits of advanced monolithic cooling for 2.5 D heterogeneous ICs SK Rajan, A Kaul, GS May, MS Bakir 2021 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2021 | 1 | 2021 |
| Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication R Saligram, A Kaul, MS Bakir, A Raychowdhury VLSI-SoC: Design Trends: 28th IFIP WG 10.5/IEEE International Conference on …, 2021 | 1 | 2021 |
| Design and Thermal Analysis of 2.5 D and 3D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving J Sharda, M Manley, A Kaul, W Li, M Bakir, S Yu IEEE Journal of the Electron Devices Society, 2024 | | 2024 |
Shimeng YuGeorgia Institute of Technology, Professor of ECEVerified email at ece.gatech.edu
