| Effect of alumina trihydrate as additive on the mechanical properties of kenaf/polyester composite for plastic encapsulated electronic packaging application A Atiqah, MNM Ansari, MSS Kamal, A Jalar, NN Afeefah, N Ismail Journal of Materials Research and Technology 9 (6), 12899-12906, 2020 | 42 | 2020 |
| Correlation of microstructural evolution and hardness properties of 99.0 Sn-0.3 Ag-0.7 Cu (SAC0307) lead-free solder under blast wave condition WY Wan Yusoff, N Ismail, NS Safee, A Ismail, A Jalar, M Abu Bakar Soldering & Surface Mount Technology 31 (2), 102-108, 2019 | 21 | 2019 |
| A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints N Ismail, A Atiqah, A Jalar, MA Bakar, RAA Rahim, AG Ismail, AA Hamzah, ... Journal of Manufacturing Processes 83, 68-85, 2022 | 20 | 2022 |
| Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability IAR N Ismail, R Ismail, A Jalar, G Omar, EM Salleh, N Kamil Journal of Materials Science: Materials in Electronics 29 (15), 12910–12916, 2018 | 19 | 2018 |
| Electrical resistivity of Sn–3.0 Ag–0.5 Cu solder joint with the incorporation of carbon nanotubes N Ismail, A Jalar, A Afdzaluddin, MA Bakar Nanomaterials and Nanotechnology 11, 1847980421996539, 2021 | 18 | 2021 |
| Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition N Ismail, A Jalar, M Abu Bakar, NS Safee, WY Wan Yusoff, A Ismail Soldering & Surface Mount Technology 33 (1), 47-56, 2021 | 16 | 2021 |
| Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu N Ismail, A Jalar, M Abu Bakar, R Ismail, N Saedi Ibrahim Soldering & Surface Mount Technology 32 (3), 157-164, 2020 | 15 | 2020 |
| Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation N Ismail, A Jalar, M Abu Bakar, R Ismail, NS Safee, AG Ismail, NS Ibrahim Sains Malaysiana 48 (6), 1267-1272, 2019 | 12 | 2019 |
| Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging N Ismail, A Jalar, MA Bakar, R Ismail Sains Malaysiana 47 (7), 1585-1590, 2018 | 11 | 2018 |
| Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach WY Wan Yusoff, N Ismail, NFN Mohmad Lehan, A Amat, KZ Ku Ahmad, ... Soldering & Surface Mount Technology 35 (1), 51-58, 2023 | 6 | 2023 |
| Significance of intermetallic compound (IMC) layer to the reliability of a solder joint, methods of IMC layer thickness measurements MA Bakar, A Jalar, A Atiqah, N Ismail Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | 6 | 2022 |
| Surface roughness and wettability of SAC/CNT lead free solder N Ismail, R Ismail, NKA Nik Ubaidillah, A Jalar, NM Zain Materials Science Forum 857, 73-75, 2016 | 6 | 2016 |
| Cardiovascular Risk Prediction with Cardio-Ankle Vascular Index in The Malaysian Cohort Study N Abdullah, JA Blin, ASK Arifin, N Abd Jalal, N Ismail, NAM Yusof, ... Current Problems in Cardiology, 102192, 2023 | 5 | 2023 |
| Advancement of printed circuit board (PCB) surface finishes in controlling the intermetallic compound (IMC) growth in solder joints A Atiqah, A Jalar, MA Bakar, N Ismail Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | 5 | 2022 |
| Effect of shock wave on constant load behaviour of Pb-Free/CNT solder joint N Ismail, A Jalar, WYW Yusoff, NS Safee, A Ismail Sains Malaysiana 49 (12), 3037-3044, 2020 | 5 | 2020 |
| Kesan penambahan tiubnano karbon terhadap pertumbuhan lapisan sebatian antara logam sistem pateri Sn-Ag-Cu/Cu akibat penuaan terma N Ismail, A Jalar, MA Bakar, R Ismail Sains Malaysiana 47 (7), 1585-1590, 2018 | 5 | 2018 |
| Flux modification for wettability and reliability improvement in solder joints N Ismail, A Jalar, MA Bakar, A Atiqah Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | 4 | 2022 |
| Properties of recycled metal matrix composites A Atiqah, N Ismail, KK Lim, A Jalar, MA Bakar, MA Maleque, RA Ilyas, ... Recycling of Plastics, Metals, and Their Composites, 93-107, 2021 | 4 | 2021 |
| Effect of temperature on strain-induced hardness of Lead-Free solder wire using nanoindentation approach P Nano, N ISMAIL, MABU BAKAR, SB BAKARUDIN Sains Malaysiana 49 (12), 3073-3080, 2020 | 4 | 2020 |
| Effect of shock wave on micromechanical properties of SAC 0307/ENiG solder joint using nanoindentation approach M Abu Bakar, A Jalar, WYW Yusoff, NS Safee, A Ismail, N Ismail, ... Sains Malaysiana 48 (6), 1273-1279, 2019 | 4 | 2019 |
