| Three-dimensional and 2.5 dimensional interconnection technology: state of the art D Liu, S Park Journal of Electronic Packaging 136 (1), 014001, 2014 | 58 | 2014 |
| Investigation of stress in MEMS sensor device due to hygroscopic and viscoelastic behavior of molding compound Y Kim, D Liu, H Lee, R Liu, D Sengupta, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 38 | 2015 |
| A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5 D Liu, S Park Journal of Electronic Packaging 136 (3), 034501, 2014 | 34 | 2014 |
| Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions J Wang, R Liu, D Liu, S Park Microelectronics Reliability 73, 42-53, 2017 | 27 | 2017 |
| An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system D Liu, J Wang, R Liu, SB Park Microelectronics Reliability, 2016 | 23 | 2016 |
| Pair of Partially-Coupled Beams Subjected to Concentrated Force MA Gharaibeh, D Liu, JM Pitarresi IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017 | 15 | 2017 |
| Stress evolution in an encapsulated MEMS package due to viscoelasticity of packaging materials S Park, D Liu, Y Kim, H Lee, X Zhang Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 70-75, 2012 | 15 | 2012 |
| A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications S Shao, D Liu, Y Niu, K O’Donnell, D Sengupta, S Park Sensors 17 (2), 322, 2017 | 12 | 2017 |
| Die Stress in Stealth Dicing for MEMS S Shao, D Liu, Y Niu, SB Park The Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2016 | 12 | 2016 |
| AN EXPERIMENTAL AND NUMERICAL STUDY OF THE BEHAVIOR OF THE THIN GLASS EDGE UNDER BALL DROP IMPACT L Xue, D Liu, H Lee, D Yu, S Chaparala, S Park | 5* | 2013 |
| Effect of High Tg Mold Compound on MEMS Sensor Package Performance Y Kim, D Sengupta, B Dufort, M Zylinski, D Liu Electronic Components and Technology Conference, 2016 | 1 | 2016 |
| Packaging-induced stresses on microelectromechanical systems D Liu State University of New York at Binghamton, 2015 | 1 | 2015 |
| Calibrating sensor alignment with applied bending moment YC Yinan Wu, Navid Poulad, Dapeng Liu, Trevor Grant Boswell, Rayna DEMASTER ... US Patent US20220385881A1, 2021 | | 2021 |
| Reviewer’s Recognition M Abou Dbai, J Ahn, K Akyuzlu, VA Avincola, H Anglart, A Arastu, ... Journal of Nuclear Engineering and Radiation Science 5, 010202-1, 2019 | | 2019 |
Ruiyang Liu, Ph.DSUNY BinghamtonVerified email at binghamton.edu
