| Nanoporous membrane device for ultra high heat flux thermal management DF Hanks, Z Lu, J Sircar, TR Salamon, DS Antao, KR Bagnall, B Barabadi, ... Microsystems & nanoengineering 4 (1), 1, 2018 | 96 | 2018 |
| Design and modeling of membrane-based evaporative cooling devices for thermal management of high heat fluxes Z Lu, TR Salamon, S Narayanan, KR Bagnall, DF Hanks, DS Antao, ... IEEE transactions on components, packaging and manufacturing technology 6 (7 …, 2016 | 89 | 2016 |
| Parametric study of thin film evaporation from nanoporous membranes KL Wilke, B Barabadi, Z Lu, TJ Zhang, EN Wang Applied Physics Letters 111 (17), 2017 | 69 | 2017 |
| Sub-minute response time of a hollow-core photonic bandgap fiber gas sensor RM Wynne, B Barabadi, KJ Creedon, A Ortega Journal of Lightwave Technology 27 (11), 1590-1596, 2009 | 67 | 2009 |
| High heat flux evaporation of low surface tension liquids from nanoporous membranes DF Hanks, Z Lu, J Sircar, I Kinefuchi, KR Bagnall, TR Salamon, DS Antao, ... ACS applied materials & interfaces 12 (6), 7232-7238, 2020 | 48 | 2020 |
| Thermal performance of GaN/Si HEMTs using near-bandgap thermoreflectance imaging G Pavlidis, L Yates, D Kendig, CF Lo, H Marchand, B Barabadi, S Graham IEEE Transactions on Electron Devices 67 (3), 822-827, 2020 | 26 | 2020 |
| Gas-filling dynamics of a hollow-core photonic bandgap fiber for nonvacuum conditions R Wynne, B Barabadi Applied Optics 54 (7), 1751-1757, 2015 | 26 | 2015 |
| Electrowetting-on-dielectric actuation of a vertical translation and angular manipulation stage DJ Preston, A Anders, B Barabadi, E Tio, Y Zhu, DRA Dai, EN Wang Applied Physics Letters 109 (24), 2016 | 24 | 2016 |
| Athermal operation of multi-section slotted tunable lasers MJ Wallace, ROR Meehan, R Enright, F Bello, D McCloskey, B Barabadi, ... Optics Express 25 (13), 14414-14426, 2017 | 21 | 2017 |
| On the characterization of lifting forces during the rapid compaction of deformable porous media B Barabadi, R Nathan, K Jen, Q Wu Journal of heat transfer 131 (10), 101006, 2021 | 18 | 2021 |
| Transient heat conduction in on-chip interconnects using proper orthogonal decomposition method B Barabadi, S Kumar, YK Joshi Journal of Heat Transfer 139 (7), 072101, 2017 | 17 | 2017 |
| Controlled wetting in nanoporous membranes for thin film evaporation KL Wilke, B Barabadi, TJ Zhang, EN Wang Journal of Heat Transfer 138 (8), 080906, 2016 | 14 | 2016 |
| Reduced order modeling of transient heat transfer in microchip interconnects A Nokhosteen, M Soltani, B Barabadi Journal of Electronic Packaging 141 (1), 011002, 2019 | 13 | 2019 |
| Multiscale transient thermal analysis of microelectronics B Barabadi, S Kumar, V Sukharev, YK Joshi Journal of Electronic Packaging 137 (3), 031002, 2015 | 12 | 2015 |
| Simultaneously sensing multiple gases using a single length of hollow-core photonic bandgap fiber with sub-minute response times RM Wynne, K Creedon, B Barabadi, S Vedururu, J Merritt, A Ortega Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in …, 2008 | 12 | 2008 |
| Prediction of transient thermal behavior of planar interconnect architecture using proper orthogonal decomposition method B Barabadi, YK Joshi, S Kumar International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 10 | 2011 |
| High heat flux evaporation from nanoporous silicon membranes JD Sircar, DF Hanks, Z Lu, T Salamon, KR Bagnall, S Narayanan, ... 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 9 | 2017 |
| Rapid multi-scale transient thermal modeling of packaged microprocessors using hybrid approach B Barabadi, YK Joshi, S Kumar 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 157-164, 2012 | 7 | 2012 |
| Thermal characterization of planar interconnect architectures under different rapid transient currents using the transmission line matrix and finite element methods B Barabadi, YK Joshi, S Kumar, G Refai-Ahmed 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 5 | 2010 |
| Thermal characterization of planar interconnect architectures under transient currents B Barabadi, YK Joshi, S Kumar, G Refai-Ahmed ASME International Mechanical Engineering Congress and Exposition 43826 …, 2009 | 5 | 2009 |
Evelyn N WangMechanical Engineering, MITVerified email at mit.edu
