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Co-authors
C R Kao
Professor of Materials Science & Engineering, National Taiwan University
Verified email at ntu.edu.tw
Donovan Leonard
Oak Ridge National Laboratory
Verified email at ornl.gov
Katsuyuki Sakuma
Manager, Principal Research Staff Member, IBM Thomas J. Watson Research Center
Verified email at us.ibm.com
David Danovitch
Professor of Electrical and Computor Engineering, Université de Sherbrooke
Verified email at usherbrooke.ca
Mukta Ghate Farooq
IBM
Verified email at us.ibm.com
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Sung-Kwon Kang
IBM Research retired
Verified email at us.ibm.com
materials science
metallurgy
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Articles
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Cited by
Year
Observation of the Structure of Grain Boundaries in Thin Bicrystal Films Produced by a New Technique
F Cosandey, SK Kang, CL Bauer
J. Phys.(Paris) 36 (10)
, 1975
1975
Precipitation in Thin Foils of A1-4 Wt.% Cu Alloys
SK Kang
Graduate School of Arts and Sciences, University of Pennsylvania
, 1973
1973
Precipitation in Thin Foils of Al-4 Wt per cent Cu Alloys
SK Kang
Pennsylvania Univ., Philadelphia. 1973, 284
, 1973
1973
The Evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders during High Temperature Aging
SKSSK Kang, DY Shih, HM Lee
Korea 305, 701
, 0
An Overview of Lead (Pb)-Free Solders and Soldering Technologies in Microelectronics
SK Kang
Study on Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction Analysis
S Cho, J Yu, SK Kang, DY Shih
Study of Oxidation of Sn-Pb Solders for Microelectronic Applications
S Cho, J Yu, SK Kang, DY Shih
Special Issue Papers
S Jin, DR Frear, JW Morris Jr, J Glazer, SK Kang, AK Sarkhel, EP Wood, ...
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