| Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates SP Yap, PZC Chen, Y Goh, HA Ibrahim, KH Mo, CW Yuen Journal of cleaner production 181, 155-165, 2018 | 164 | 2018 |
| Hydraulic and strength characteristics of pervious concrete containing a high volume of construction and demolition waste as aggregates HA Ibrahim, Y Goh, ZA Ng, SP Yap, KH Mo, CW Yuen, F Abutaha Construction and Building Materials 253, 119251, 2020 | 89 | 2020 |
| Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder Y Goh, A Haseeb, MFM Sabri Electrochimica Acta 90, 265-273, 2013 | 85 | 2013 |
| Bamboo: the emerging renewable material for sustainable construction Y Goh, SP Yap, TY Tong Reference Module in Materials Science and Materials Engineering. Elsevier, 1-14, 2019 | 51 | 2019 |
| Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints Y Goh, A Haseeb, HL Liew, MFM Sabri Journal of Materials Science 50, 4258-4269, 2015 | 38 | 2015 |
| Electrodeposition of lead-free solder alloys Y Goh, A Haseeb, M Faizul Mohd Sabri Soldering & Surface Mount Technology 25 (2), 76-90, 2013 | 18 | 2013 |
| Relationship between microstructure and performance of polypropylene fibre reinforced cement composites subjected to elevated temperature SP Yap, Y Goh, WX Goh, KH Mo, MYJ Liu, HA Ibrahim European Journal of Environmental and Civil Engineering 26 (5), 1792-1806, 2022 | 16 | 2022 |
| Effects of Mn nanoparticles on wettability and intermetallic compounds in between Sn-3.8 Ag-0.7 Cu and Cu substrate during multiple reflow KK Xiang, A Haseeb, MM Arafat, G Yingxin 2012 4th Asia Symposium on Quality Electronic Design (ASQED), 297-301, 2012 | 16 | 2012 |
| Potential of municipal woody biomass waste ash in the production of cold-bonded lightweight aggregates J Lin, KH Mo, Y Goh, CC Onn Journal of Building Engineering 63, 105392, 2023 | 13 | 2023 |
| Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow Y Goh, SF Lee, ASMA Haseeb Journal of Materials Science: Materials in Electronics 24, 2052-2057, 2013 | 12 | 2013 |
| Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review LS Kamaruzzaman, Y Goh Soldering & Surface Mount Technology 34 (5), 300-318, 2022 | 11 | 2022 |
| Recycling of Construction and Demolition Wastes into Renewable Construction Materials SP Yap, Y Goh, KH Mo, HA Ibrahim Elsevier, 2020 | 11 | 2020 |
| Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin Y Goh, A Haseeb Journal of Materials Science 51 (12), 5823-5833, 2016 | 11 | 2016 |
| Electronic Packaging: Lead Frame Materials JF Breedis, PY Chia, Y Goh Elsevier, 2017 | 10* | 2017 |
| Municipal woody biomass waste ash-based cold-bonded artificial lightweight aggregate produced by one-part alkali-activation method J Lin, TH Tan, JS Yeo, Y Goh, TC Ling, KH Mo Construction and Building Materials 394, 131619, 2023 | 7 | 2023 |
| Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers Y Goh, YS Goh, EL Lee, MT Ong, A Haseeb Journal of Materials Science: Materials in Electronics 29, 5791-5798, 2018 | 6 | 2018 |
| Effects of Sn concentration and current density on Sn-Bi electrodeposition in additive free plating bath CY Heong, A Haseeb, G Yingxin, LS Fang 2012 4th Asia Symposium on Quality Electronic Design (ASQED), 286-290, 2012 | 6 | 2012 |
| Microbial self-healing in concrete: A comprehensive exploration of bacterial viability, implementation techniques, and mechanical properties Y Javeed, Y Goh, KH Mo, SP Yap, BF Leo Journal of Materials Research and Technology 29, 2376-2395, 2024 | 5 | 2024 |
| The Potential of Geopolymer in Development of Green Coating Materials: A Review LS Soong, MYJ Liu, SP Yap, KH Mo, MZ Jumaat, Y Goh Arabian Journal for Science and Engineering 47 (10), 12289-12299, 2022 | 5 | 2022 |
| Growth and mechanical properties of intermetallic compound between solid cobalt and molten tin EL Lee, Y Goh, A Haseeb Journal of Materials Science: Materials in Electronics 31, 4554-4562, 2020 | 5 | 2020 |
