| Synergistic ultrathin functional polymer-coated carbon nanotube interlayer for high performance lithium–sulfur batteries JH Kim, J Seo, J Choi, D Shin, M Carter, Y Jeon, C Wang, L Hu, U Paik ACS Applied Materials & Interfaces 8 (31), 20092-20099, 2016 | 104 | 2016 |
| Synergistic protective effect of a BN-carbon separator for highly stable lithium sulfur batteries PJH Kim, J Seo, K Fu, J Choi, Z Liu, J Kwon, L Hu, U Paik NPG Asia Materials 9 (4), e375-e375, 2017 | 101 | 2017 |
| A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization J Seo Journal of Materials Research 36, 235-257, 2021 | 82 | 2021 |
| Almost complete removal of ceria particles down to 10 nm size from silicon dioxide surfaces J Seo, A Gowda, SV Babu ECS Journal of Solid State Science and Technology 7 (5), P243, 2018 | 68 | 2018 |
| Ammonium persulfate and potassium oleate containing silica dispersions for chemical mechanical polishing for cobalt interconnect applications CK Ranaweera, NK Baradanahalli, R Popuri, J Seo, SV Babu ECS Journal of Solid State Science and Technology 8 (5), P3001, 2018 | 57 | 2018 |
| Role of the oxidation state of cerium on the ceria surfaces for silicate adsorption J Seo, J Moon, JH Kim, K Lee, J Hwang, H Yoon, DK Yi, U Paik Applied Surface Science 389, 311-315, 2016 | 50 | 2016 |
| Role of the surface chemistry of ceria surfaces on silicate adsorption J Seo, JW Lee, J Moon, W Sigmund, U Paik ACS applied materials & interfaces 6 (10), 7388-7394, 2014 | 47 | 2014 |
| Post-CMP cleaning solutions for the removal of organic contaminants with reduced galvanic corrosion at copper/cobalt interface for advanced Cu interconnect applications J Seo, SH Vegi, SV Babu ECS Journal of Solid State Science and Technology 8 (8), P379, 2019 | 40 | 2019 |
| Formation of cobalt-BTA complexes and their removal from various surfaces relevant to cobalt interconnect applications J Seo, SH Vegi, CK Ranaweera, NK Baradanahalli, JH Han, D Koli, ... ECS Journal of Solid State Science and Technology 8 (5), P3009, 2018 | 36 | 2018 |
| Multi-objective optimization of tungsten CMP slurry for advanced semiconductor manufacturing using a response surface methodology J Seo, JH Kim, M Lee, K You, J Moon, DH Lee, U Paik Materials & Design 117, 131-138, 2017 | 36 | 2017 |
| Two-dimensional Nafion nanoweb anion-shield for improved electrochemical performances of lithium–sulfur batteries JH Kim, J Choi, J Seo, J Kwon, U Paik Journal of materials chemistry A 4 (29), 11203-11206, 2016 | 32 | 2016 |
| Preparation and characterization of slurry for chemical mechanical planarization (CMP) J Seo, U Paik Advances in chemical mechanical planarization (CMP), 273-298, 2016 | 29 | 2016 |
| Size-dependent interactions of silica nanoparticles with a flat silica surface J Seo, JH Kim, M Lee, J Moon, DK Yi, U Paik Journal of colloid and interface science 483, 177-184, 2016 | 27 | 2016 |
| Cleaning solutions for removal of∼ 30 nm ceria particles from proline and citric acid containing slurries deposited on silicon dioxide and silicon nitride surfaces A Gowda, J Seo, CK Ranaweera, SV Babu ECS Journal of Solid State Science and Technology 9 (4), 044013, 2020 | 24 | 2020 |
| Ce3+-enriched core–shell ceria nanoparticles for silicate adsorption K Kim, J Seo, M Lee, J Moon, K Lee, DK Yi, U Paik Journal of Materials Research 32, 2829-2836, 2017 | 18 | 2017 |
| Control of adhesion force between ceria particles and polishing pad in shallow trench isolation chemical mechanical planarization J Seo, J Moon, JY Bae, KS Yoon, W Sigmund, U Paik Journal of nanoscience and nanotechnology 14 (6), 4351-4356, 2014 | 18 | 2014 |
| Interpolymer complexes of poly (acrylic acid) and poly (ethylene glycol) for low dishing in STI CMP J Seo, J Moon, S Moon, U Paik Applied Surface Science 353, 499-503, 2015 | 16 | 2015 |
| Polishing slurry composition JH Yoon, SC Hong, YH Yoon, U Paik, JH Seo, KJ Kim, KC Lee US Patent App. 15/325,095, 2017 | 13 | 2017 |
| Effects of physico-chemical properties between poly (ethyleneimine) and silica abrasive on copper chemical mechanical planarization J Seo, KS Yoon, J Moon, K Kim, W Sigmund, U Paik Microelectronic engineering 113, 50-54, 2014 | 13 | 2014 |
| Communication—synergistic effect of mixed particle size on W CMP process: optimization using experimental design J Seo, J Moon, Y Kim, K Kim, K Lee, Y Cho, DH Lee, U Paik ECS Journal of Solid State Science and Technology 6 (1), P42, 2016 | 12 | 2016 |
Ungyu PaikHanyang UniversityVerified email at hanyang.ac.kr
