| Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing E Kim, J Lee, C Bae, H Seok, HU Kim, T Kim Powder Technology, 2021 | 31 | 2021 |
| Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing E Kim, J Lee, Y Park, C Shin, J Yang, T Kim Powder Technology 381, 451-458, 2021 | 14 | 2021 |
| Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction J Lee, E Kim, C Bae, H Seok, J Cho, K Aydin, T Kim Materials Science in Semiconductor Processing 159, 107349, 2023 | 13 | 2023 |
| Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films J Song, K Park, S Jeon, J Lee, T Kim Materials Science in Semiconductor Processing 140, 106353, 2022 | 10 | 2022 |
| Effect of Viscosity on Ceria Abrasive Removal during the Buff Clean Process J Kim, S Hong, E Kim, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... ECS Journal of Solid State Science and Technology 9 (8), 084003, 2020 | 10 | 2020 |
| Communication—Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning S Hong, SH Park, C Kanade, J Lee, P Liu, I Lee, H Seok, T Kim ECS Journal of Solid State Science and Technology 9 (4), 044012, 2020 | 9 | 2020 |
| Activation of nitrogen species mixed with Ar and H2S plasma for directly N-doped TMD films synthesis J Cho, H Seok, I Lee, J Lee, E Kim, D Sung, IK Baek, CH Lee, T Kim Scientific reports 12 (1), 1-8, 2022 | 6 | 2022 |
| Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing L Xu, P Liu, H Lei, K Park, E Kim, Y Cho, J Lee, S Park, T Kim Precision Engineering, 2021 | 6 | 2021 |
| Synapse-Mimetic Hardware-Implemented Resistive Random-Access Memory for Artificial Neural Network H Seok, S Son, SB Jathar, J Lee, T Kim Sensors 23 (6), 3118, 2023 | 5 | 2023 |
| Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning J Lee, H Seo, SH Park, E Kim, J Lee, P Liu, S Jeon, S Hong, T Kim Materials Science in Semiconductor Processing 145, 106618, 2022 | 3 | 2022 |
| Investigations on the mechanism of silica particle removal during the Cu buff cleaning process P Liu, S Hong, S Jeon, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... Colloids and Surfaces A: Physicochemical and Engineering Aspects 627, 127156, 2021 | 3 | 2021 |
| Communication—A Novel Method to Improve Cleaning Performance by Removing Small Particles in CMP Slurry J Lee, SH Park, S Hong, H Seo, P Liu, E Kim, T Kim ECS Journal of Solid State Science and Technology 10 (2), 024001, 2021 | 2 | 2021 |
Taesung KimSungkyunkwan UniversityVerified email at skku.edu
