| Understanding the plasticity contributions during laser-shock loading and spall failure of Cu microstructures at the atomic scales MJ Echeverria, S Galitskiy, A Mishra, R Dingreville, AM Dongare Computational Materials Science 198, 110668, 2021 | 17 | 2021 |
| Virtual texture analysis to investigate the deformation mechanisms in metal microstructures at the atomic scale A Mishra, MJ Echeverria, K Ma, S Parida, C Chen, S Galitskiy, ... Journal of Materials Science 57 (23), 10549-10568, 2022 | 10 | 2022 |
| Fingerprinting shock-induced deformations via diffraction A Mishra, C Kunka, MJ Echeverria, R Dingreville, AM Dongare Scientific reports 11 (1), 9872, 2021 | 8 | 2021 |
| Atomistic study of silicon alloying in the spallation behavior of nanocrystalline aluminum systems S Suresh, MJ Echeverria, AM Dongare AIP Conference Proceedings 2272 (1), 2020 | 2 | 2020 |
| Damage initiation and evolution in Al-Si layered microstructures under shock loading conditions at atomic scales MJ Echeverria, S Suresh, A Dongare AIP Conference Proceedings 2272 (1), 2020 | 2 | 2020 |
| Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging MJ Echeverría, PO Quintero, D Ibitayo, L Boteler International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 2 | 2018 |
| Hydrodynamic and atomistic studies in support of high power laser experiments for metal ejecta recollection and interactions T Haxhimali, M Echeverria, F Najjar, P Tzeferacos, SJ Ali, HS Park, ... AIP Conference Proceedings 2272 (1), 2020 | 1 | 2020 |
| On Parametric Analysis of Cold Spray of Metallic Coating Onto Ceramic Substrates Using Ceramic Damage Evolution Approach MJ EcheverrÍa, PO Quintero, O Ozdemir, D Ibitayo, VK Champagne ITSC2019, 816-823, 2019 | 1 | 2019 |
| New modified embedded-atom method interatomic potential to understand deformation behavior in VNbTaTiZr refractory high entropy alloy MS Nitol, MJ Echeverria, K Dang, MI Baskes, SJ Fensin Computational Materials Science 237, 112886, 2024 | | 2024 |
Avinash DongareDepartment of Materials Science and Engineering, and Institute of Materials ScienceVerified email at uconn.edu
