| Current problems and possible solutions in high-temperature lead-free soldering A Kroupa, D Andersson, N Hoo, J Pearce, A Watson, A Dinsdale, ... Journal of Materials Engineering and Performance 21, 629-637, 2012 | 86 | 2012 |
| Scattering of fast molecular hydrogen from Ag (111) U Van Slooten, DR Andersson, AW Kleyn, EA Gislason Surface science 274 (1), 1-20, 1992 | 63 | 1992 |
| Scaling law for dissociation of fast molecular hydrogen scattered from Ag (1 1 1) U Van Slooten, D Andersson, AW Kleyn, EA Gislason Chemical physics letters 185 (5-6), 440-444, 1991 | 36 | 1991 |
| Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints S Akbari, A Lövberg, PE Tegehall, K Brinkfeldt, D Andersson Microelectronics Reliability 93, 61-71, 2019 | 34 | 2019 |
| Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model ASG Andræ, DR Andersson, J Liu Journal of Cleaner Production 13 (13-14), 1269-1279, 2005 | 33 | 2005 |
| Thermal cycling aging effect on the shear strength, microstructure, intermetallic compounds (IMC) and crack initiation and propagation of reflow soldered Sn-3.8 Ag-0.7 Cu and … C Andersson, PE Tegehall, DR Andersson, G Wetter, J Liu IEEE Transactions on Components and Packaging Technologies 31 (2), 331-344, 2008 | 31 | 2008 |
| Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components C Andersson, DR Andersson, PE Tegehall, J Liu 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 27 | 2004 |
| Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components A Lövberg, PE Tegehall, G Wetter, K Brinkfeldt, D Andersson 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 18 | 2017 |
| Mutiphysics study of RF/microwave planar devices: Effect of the input signal power MA Sánchez-Soriano, M Edwards, Y Quéré, D Andersson, S Cadiou, ... 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 18 | 2014 |
| Reliability of new SiC BJT power modules for fully electric vehicles A Otto, E Kaulfersch, K Brinkfeldt, K Neumaier, O Zschieschang, ... Advanced Microsystems for Automotive Applications 2014: Smart Systems for …, 2014 | 16 | 2014 |
| Thermal cycling of lead‐free Sn‐3.8 Ag‐0.7 Cu 388PBGA packages C Andersson, B Vandevelde, C Noritake, P Sun, PE Tegehall, ... Soldering & surface mount technology 21 (2), 28-38, 2009 | 14 | 2009 |
| On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints A Lövberg, PE Tegehall, S Akbari, D Andersson 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 11 | 2018 |
| The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules M Edwards, K Brinkfeldt, U Rusche, T Bukes, G Gaiser, M Da Silva, ... Microelectronics Reliability 55 (5), 722-732, 2015 | 10 | 2015 |
| Thermal simulations and experimental verification of power modules designed for double sided cooling K Brinkfeldt, J Ottosson, A Otto, A Mann, O Zschieschang, S Frankeser, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1415-1422, 2016 | 8 | 2016 |
| COSIVU—Compact, smart and reliable drive unit for fully electric vehicles DR Andersson, K Brinkfeldt, S Nord, J Ottosson, G Lampic, G Gotovac, ... 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-10, 2016 | 8 | 2016 |
| Thermo-mechanical simulations of SiC power modules with single and double sided cooling K Brinkfeldt, M Edwards, J Ottosson, K Neumaier, O Zschieschang, A Otto, ... 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 8 | 2015 |
| COSIVU-Compact, Smart and Reliable Drive Unit for Commercial Electric Vehicles T Gustafsson, S Nord, D Andersson, K Brinkfelt, F Hilpert Advanced Microsystems for Automotive Applications 2014: Smart Systems for …, 2014 | 7 | 2014 |
| Printed circuit boards for lead‐free soldering: materials and failure mechanisms P Johander, PE Tegehall, A Ahmed Osman, G Wetter, D Andersson Circuit World 33 (2), 10-16, 2007 | 7 | 2007 |
| UML modelling concepts of HAZOP to enhance the ability to identify emerging risks M Ström, R Koivisto, D Andersson Journal of Risk Research 16 (3-4), 421-432, 2013 | 6 | 2013 |
| Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal cycling testing P Sun, C Andersson, J Liu, DR Andersson, PE Tegehall, D Shangguan 2006 7th International Conference on Electronic Packaging Technology, 1-8, 2006 | 6 | 2006 |
