Microstructure, thermal behavior and joint strength of Sn-0.7 Cu-1.5 Bi/electroless nickel immersion gold (ENIG) AL Teoh, MAAM Salleh, DSC Halin, KL Foo, NRA Razak, H Yasuda, ... Journal of Materials Research and Technology 12, 1700-1714, 2021 | 9 | 2021 |
Effects of surface finish on Sn-3.0 Ag-0.5 Cu solder joint microstructure and strength SFN Muhd Amli, MAA Mohd Salleh, MII Ramli, NR Abdul Razak, ... Journal of Electronic Materials 50, 855-868, 2021 | 9 | 2021 |
Temperature dependency of the growth rate of (Cu, Ni) 6Sn5 on Cu-xNi substrates XF Tan, NRA Razak, MH Husain, S McDonald, K Nogita IOP Conference Series: Materials Science and Engineering 701 (1), 012007, 2019 | 8 | 2019 |
Effect of surface finish on the wettability and electrical resistivity of Sn-3.0 Ag-0.5 Cu solder SFM Amli, MAAM Salleh, RM Said, NRA Razak, JA Wahab, MII Ramli IOP Conference Series: Materials Science and Engineering 701 (1), 012029, 2019 | 6 | 2019 |
In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography NRA Razak, XF Tan, F Somidin, H Yasuda, SD McDonald, K Nogita Materials Letters 291, 129520, 2021 | 4 | 2021 |
Interfacial reactions between different Sn-based lead-free solder alloys and CuNi substrates NRA Razak, XF Tan, SD McDonald, K Nogita IOP Conference Series: Materials Science and Engineering 701 (1), 012008, 2019 | 4 | 2019 |
Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint NRA Razak, XF Tan, MAAM Salleh, SD McDonald, MJ Bermingham, ... Materials Today Communications 31, 103248, 2022 | 3 | 2022 |
Mixed assembly of lead-free solder joint: a short review RM Said, MAAM Salleh, MII Ramli, N Saud, F Somidin, NRA Razak, ... Journal of Physics: Conference Series 2169 (1), 012039, 2022 | 3 | 2022 |
Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7 Cu on different surface finish substrates MII Ramli, MAA Mohd Salleh, SF Muhd Amli, NR Abdul Razak Sains Malaysiana 49 (12), 3255-3259, 2020 | 3 | 2020 |
Influence of Bismuth in Sn-Based Lead-Free Solder–A Short Review NRA Razak, MAA Mohd Salleh, N Saud, RM Said, MII Ramli Solid State Phenomena 273, 40-45, 2018 | 3 | 2018 |
Physical and mechanical behaviors of SnCu-based lead-free solder alloys with an addition of aluminium N Adli, NR Abdul Razak, N Saud Applied Mechanics and Materials 815, 64-68, 2015 | 3 | 2015 |
Development of Low Cost Sn-0.7 Cu Base Composite Solder for High Temperature Application Z Mahim, N Saud, NRA Razak Materials Science Forum 803, 239-242, 2015 | 3 | 2015 |
Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0 Ag-0.5 Cu Solder Joints F Somidin, NFN Ilias, NSM Zaimi, MII Ramli, NRA Razak Journal of Physics: Conference Series 2169 (1), 012032, 2022 | 2 | 2022 |
Influence of bismuth on the solidification of tin copper lead-free solder alloy NA Ezaham, NRA Razak, M Salleh AIP Conference Proceedings 2045 (1), 2018 | 2 | 2018 |
Enhancement of microstructural and physical properties of Sn-0.7 Cu lead-free solder with the addition of SiC particles Z Mahim, NR Abdul Razak, MAA Mohd Salleh, N Saud Solid State Phenomena 280, 181-186, 2018 | 2 | 2018 |
The effects of zinc addition on the microstructure, melting point and microhardness of Sn-0.7 Cu lead-free solder fabricated via powder metallurgy method N Adli, NR Abdul Razak, N Saud Materials Science Forum 857, 13-17, 2016 | 2 | 2016 |
Mechanical Properties and Solderability of Robust Sn-0.7 Cu Lead-Free Composite Solder SA Musa, N Saud, NRA Razak, K Hussin Applied Mechanics and Materials 754, 556-560, 2015 | 2 | 2015 |
Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy NR Abdul Razak, N Adli, N Saud, SA Musa Applied Mechanics and Materials 754, 166-170, 2015 | 1 | 2015 |
Controlling porosity during transient liquid phase bonding for high-temperature soldering processes NRA Razak, XF Tan, SD McDonald, MJ Bermingham, J Venezuela, ... 2023 International Conference on Electronics Packaging (ICEP), 27-28, 2023 | | 2023 |
Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste RM Said, NRA Razak, F Somidin, NSM Zaimi Journal of Physics: Conference Series 2169 (1), 012010, 2022 | | 2022 |