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NURUL RAZLIANA ABDUL RAZAK
NURUL RAZLIANA ABDUL RAZAK
Verified email at unimap.edu.my
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Cited by
Cited by
Year
Microstructure, thermal behavior and joint strength of Sn-0.7 Cu-1.5 Bi/electroless nickel immersion gold (ENIG)
AL Teoh, MAAM Salleh, DSC Halin, KL Foo, NRA Razak, H Yasuda, ...
Journal of Materials Research and Technology 12, 1700-1714, 2021
92021
Effects of surface finish on Sn-3.0 Ag-0.5 Cu solder joint microstructure and strength
SFN Muhd Amli, MAA Mohd Salleh, MII Ramli, NR Abdul Razak, ...
Journal of Electronic Materials 50, 855-868, 2021
92021
Temperature dependency of the growth rate of (Cu, Ni) 6Sn5 on Cu-xNi substrates
XF Tan, NRA Razak, MH Husain, S McDonald, K Nogita
IOP Conference Series: Materials Science and Engineering 701 (1), 012007, 2019
82019
Effect of surface finish on the wettability and electrical resistivity of Sn-3.0 Ag-0.5 Cu solder
SFM Amli, MAAM Salleh, RM Said, NRA Razak, JA Wahab, MII Ramli
IOP Conference Series: Materials Science and Engineering 701 (1), 012029, 2019
62019
In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography
NRA Razak, XF Tan, F Somidin, H Yasuda, SD McDonald, K Nogita
Materials Letters 291, 129520, 2021
42021
Interfacial reactions between different Sn-based lead-free solder alloys and CuNi substrates
NRA Razak, XF Tan, SD McDonald, K Nogita
IOP Conference Series: Materials Science and Engineering 701 (1), 012008, 2019
42019
Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint
NRA Razak, XF Tan, MAAM Salleh, SD McDonald, MJ Bermingham, ...
Materials Today Communications 31, 103248, 2022
32022
Mixed assembly of lead-free solder joint: a short review
RM Said, MAAM Salleh, MII Ramli, N Saud, F Somidin, NRA Razak, ...
Journal of Physics: Conference Series 2169 (1), 012039, 2022
32022
Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7 Cu on different surface finish substrates
MII Ramli, MAA Mohd Salleh, SF Muhd Amli, NR Abdul Razak
Sains Malaysiana 49 (12), 3255-3259, 2020
32020
Influence of Bismuth in Sn-Based Lead-Free Solder–A Short Review
NRA Razak, MAA Mohd Salleh, N Saud, RM Said, MII Ramli
Solid State Phenomena 273, 40-45, 2018
32018
Physical and mechanical behaviors of SnCu-based lead-free solder alloys with an addition of aluminium
N Adli, NR Abdul Razak, N Saud
Applied Mechanics and Materials 815, 64-68, 2015
32015
Development of Low Cost Sn-0.7 Cu Base Composite Solder for High Temperature Application
Z Mahim, N Saud, NRA Razak
Materials Science Forum 803, 239-242, 2015
32015
Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0 Ag-0.5 Cu Solder Joints
F Somidin, NFN Ilias, NSM Zaimi, MII Ramli, NRA Razak
Journal of Physics: Conference Series 2169 (1), 012032, 2022
22022
Influence of bismuth on the solidification of tin copper lead-free solder alloy
NA Ezaham, NRA Razak, M Salleh
AIP Conference Proceedings 2045 (1), 2018
22018
Enhancement of microstructural and physical properties of Sn-0.7 Cu lead-free solder with the addition of SiC particles
Z Mahim, NR Abdul Razak, MAA Mohd Salleh, N Saud
Solid State Phenomena 280, 181-186, 2018
22018
The effects of zinc addition on the microstructure, melting point and microhardness of Sn-0.7 Cu lead-free solder fabricated via powder metallurgy method
N Adli, NR Abdul Razak, N Saud
Materials Science Forum 857, 13-17, 2016
22016
Mechanical Properties and Solderability of Robust Sn-0.7 Cu Lead-Free Composite Solder
SA Musa, N Saud, NRA Razak, K Hussin
Applied Mechanics and Materials 754, 556-560, 2015
22015
Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy
NR Abdul Razak, N Adli, N Saud, SA Musa
Applied Mechanics and Materials 754, 166-170, 2015
12015
Controlling porosity during transient liquid phase bonding for high-temperature soldering processes
NRA Razak, XF Tan, SD McDonald, MJ Bermingham, J Venezuela, ...
2023 International Conference on Electronics Packaging (ICEP), 27-28, 2023
2023
Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste
RM Said, NRA Razak, F Somidin, NSM Zaimi
Journal of Physics: Conference Series 2169 (1), 012010, 2022
2022
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