Get my own profile
Public access
View all7 articles
3 articles
available
not available
Based on funding mandates
Co-authors
- Edmund F. PalermoAssociate Professor, Rensselaer Polytechnic Institute, Materials Science & EngineeringVerified email at rpi.edu
- Stephen Z. D. ChengUniversity of Akron, South China University of Technology, Donghua University, RensselaerVerified email at uakron.edu
- Mingjun HuangSCUT; MIT; UAkronVerified email at scut.edu.cn
- Cansu ErgeneGraduate Research Assistant, Rensselaer Polytechnic InstituteVerified email at rpi.edu
- Chaitanya UllalAssociate Professor of Materials Science and EngineeringVerified email at rpi.edu
- Harikrishnan VijayamohananIntel CorporationVerified email at intel.com
- Xin NingRensselaer Polytechnic InstituteVerified email at rpi.edu
- Yang HuApplied Materials, Rensselaer Polytechnic InstituteVerified email at amat.com
Follow
Zhe Zhou
Intel Corporation; Rensselaer Polytechnic institute; the University of Akron
Verified email at intel.com