| Probing phase distribution in 2D perovskites for efficient device design N Liu, P Liu, H Ren, H Xie, N Zhou, Y Gao, Y Li, H Zhou, Y Bai, Q Chen ACS applied materials & interfaces 12 (2), 3127-3133, 2019 | 45 | 2019 |
| Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding H Ren, YT Yang, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 149-156, 2022 | 13 | 2022 |
| Mechanism and process window study for die-to-wafer (D2W) hybrid bonding H Ren, YT Yang, G Ouyang, SS Iyer ECS Journal of Solid State Science and Technology 10 (6), 064008, 2021 | 12 | 2021 |
| Fabrication of Flexible Li-ion Battery Electrodes Using" Battlets" Approach with Ionic Liquid Electrolyte for Powering Wearable Devices G Ouyang, G Whang, E MacInnis, H Ren, H Sun, R Irwin, B Dunn, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 780-785, 2022 | 4 | 2022 |
| A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils G Ouyang, G Ezhilarasu, H Sun, H Ren, YT Yang, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2266-2271, 2021 | 4 | 2021 |
| Surface diffusion controlled reaction in small size microbumps Y Liu, X Shi, H Ren, J Cai, X Zhao, C Tan, KN Tu Materials Letters 284, 129036, 2021 | 4 | 2021 |
| A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration K Sahoo, H Ren, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 362-366, 2023 | 3 | 2023 |
| A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding J Shin, K Woo, D Kwon, Y Kim, Y Lee, D Kang, K Sahoo, H Ren, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1158-1162, 2022 | 2 | 2022 |
| Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications YT Yang, C Hu, P Zhang, N Shakoorzadeh, H Ren, N Ni, KL Wang, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1577-1582, 2021 | 2 | 2021 |
| Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems H Ren, K Sahoo, T Xiang, G Ouyang, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1614-1621, 2023 | 1 | 2023 |
| TSV-less Power Delivery for Wafer-scale Assemblies and Interposers H Ren, S Pal, G Ouyang, R Irwin, YT Yang, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1934-1939, 2022 | 1 | 2022 |
| Fine-Pitch (≤ 10 µm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application YT Yang, C Hu, P Zhang, H Ren, N Ni, KL Wang, SS Iyer 2021 IEEE International Electron Devices Meeting (IEDM), 1-4, 2021 | 1 | 2021 |
| Compositional Engineering for Compact Perovskite Absorber Fabrication Toward Efficient Photovoltaics G Liu, X Niu, Y Bai, N Li, S Tan, H Ren, H Zhou, X Li, Q Chen IEEE Journal of Photovoltaics 10 (3), 765-770, 2020 | 1 | 2020 |
| Heterogeneous Power Delivery for Large Chiplet-based Systems using Integrated GaN/Si-Interconnect Fabric with sub-10 μm Bond Pitch H Ren, K Sahoo, Z Guo, R Pugazhendhi, Z Wong, T Xiang, TS Fisher, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | | 2023 |
| Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding A Kuchhangi, H Ren, K Sahoo, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1633-1637, 2023 | | 2023 |
| 3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices G Ouyang, T Fukushima, H Ren, SS Iyer 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 601-605, 2023 | | 2023 |
| A thin film and high roughness flexible current collector for high charging/discharging rate flexible Li-ion battery G Ouyang, H Ren, H Sun, SS Iyer 2022 IEEE International Flexible Electronics Technology Conference (IFETC), 1-3, 2022 | | 2022 |
| RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications YT Yang, H Ren, SK Chong, G Qiu, SY Ku, Y Cheng, C Hu, T Qian, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 949-955, 2022 | | 2022 |
| Reliability Considerations for Wafer Scale Systems NS Chase, R Irwin, YT Yang, H Ren, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 84-89, 2021 | | 2021 |
| Process Development and Process Window Investigation of Copper-Silicon Dioxide Die-to-Wafer (D2W) Hybrid Bonding H Ren UCLA, 2021 | | 2021 |
