| Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010 | 388 | 2010 |
| Method for insertion bonding and device thus obtained E Beyne, P Limaye US Patent 9,508,665, 2016 | 170 | 2016 |
| Hermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages B Vandevelde, M Gonzalez, P Limaye, P Ratchev, E Beyne 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 167 | 2004 |
| Cu/Sn microbumps interconnect for 3D TSV chip stacking R Agarwal, W Zhang, P Limaye, R Labie, B Dimcic, A Phommahaxay, ... 2010 Proceedings 60th electronic components and technology conference (ECTC …, 2010 | 112 | 2010 |
| Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking R Labie, P Limaye, KW Lee, CJ Berry, E Beyne, I De Wolf 3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010 | 60 | 2010 |
| High density Cu-Sn TLP bonding for 3D integration R Agarwal, W Zhang, P Limaye, W Ruythooren 2009 59th electronic components and technology conference, 345-349, 2009 | 51 | 2009 |
| Window interposed die packaging E Beyne, P Limaye US Patent 8,907,471, 2014 | 42 | 2014 |
| Influence of intermetallic properties on reliability of lead-free flip-chip solder joints P Limaye, B Vandevelde, R Labie, D Vandepitte, B Verlinden IEEE Transactions on advanced packaging 31 (1), 51-57, 2008 | 34 | 2008 |
| Insertion bonding: A novel Cu-Cu bonding approach for 3D integration C Okoro, R Agarwal, P Limaye, B Vandevelde, D Vandepitte, E Beyne 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 32 | 2010 |
| Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic … R Salenbien, R Côte, J Goossens, P Limaye, R Labie, C Glorieux Journal of Applied Physics 109 (9), 2011 | 29 | 2011 |
| Creep behavior of mixed SAC 405/SnPb soldered assemblies in shear loading P Limaye, R Labie, B Vandevelde, D Vandepitte, B Verlinden 2007 9th Electronics Packaging Technology Conference, 703-712, 2007 | 27 | 2007 |
| Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly N Van Steenberge, P Limaye, G Willems, B Vandevelde, I Schildermans Microelectronics Reliability 47 (2-3), 215-222, 2007 | 26 | 2007 |
| A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints K Lambrinou, W Maurissen, P Limaye, B Vandevelde, B Verlinden, ... Journal of electronic materials 38, 1881-1895, 2009 | 25 | 2009 |
| Crack growth rate measurement and analysis for WLCSP SnAgCu solder joints P Limaye, B Vandevelde, D Vandepitte, B Verlinden Circuits Assembly 17 (2), 68, 2006 | 25 | 2006 |
| Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration W Zhang, P Limaye, Y Civale, R Labie, P Soussan 3rd Electronics System Integration Technology Conference ESTC, 1-4, 2010 | 22 | 2010 |
| Thermal cycle reliability of 3D chip stacked package using Pb-free solder bumps: Parameter study by FEM analysis C Noritake, P Limaye, M Gonzalez, B Vandevelde EuroSime 2006-7th International Conference on Thermal, Mechanical and …, 2006 | 18 | 2006 |
| Zero-level packaging for (RF-) MEMS implementing TSVs and metal bonding NP Pham, V Cherman, B Vandevelde, P Limaye, N Tutunjyan, R Jansen, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1588-1595, 2011 | 17 | 2011 |
| Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack-Challenges and solutions G Van der Plas, S Thijs, D Linten, G Katti, P Limaye, A Mercha, M Stucchi, ... IEEE Custom Integrated Circuits Conference 2010, 1-4, 2010 | 16 | 2010 |
| Surface planarization of Cu/Sn micro-bump and its application in fine pitch Cu/Sn solid state diffusion bonding W Zhang, P Limaye, R Agarwal, P Soussan 2010 12th Electronics Packaging Technology Conference, 143-146, 2010 | 12 | 2010 |
| Metal-bonded, hermetic 0-level package for MEMS NP Pham, P Limaye, P Czarnecki, VP Olalla, V Cherman, DS Tezcan, ... 2010 12th Electronics Packaging Technology Conference, 1-6, 2010 | 11 | 2010 |
