| Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders M Khairi Faiz, K Bansho, T Suga, T Miyashita, M Yoshida Journal of Materials Science: Materials in Electronics 28, 16433-16443, 2017 | 20 | 2017 |
| Novel algorithm for mobile robot path planning in constrained environment A Muhammad, MAH Ali, S Turaev, IH Shanono, F Hujainah, MNM Zubir, ... Computers, Materials and Continua 71 (2), 2697-2719, 2022 | 16 | 2022 |
| Heatsink design using spiral-fins considering additive manufacturing S Otake, Y Tateishi, H Gohara, R Kato, Y Ikeda, V Parque, MK Faiz, ... 2019 International Conference on Electronics Packaging (ICEP), 46-51, 2019 | 9 | 2019 |
| Influence of solid cohesion on viscous properties in Norton law for aluminum alloys during partial solidification Y Nagata, R Takai, T Okane, MK Faiz, M Yoshida Materials Science and Engineering: A 832, 142339, 2022 | 6 | 2022 |
| Low temperature and low pressure bonding of plateless Cu–Cu substrates by Ag-based transient liquid phase sintering KF Muhammad, T Yamamoto, M Yoshida Journal of Materials Science: Materials in Electronics 28, 9351-9362, 2017 | 5 | 2017 |
| Effect of sand mold constraint on warpage deformation of lamellar graphite gray cast iron and prediction by elastoplastic-creep finite element analysis M Khairi Faiz, K Uehara, T Nakajima, T Kanno, Y Hiramoto, T Miyashita, ... Journal of Materials Engineering and Performance 30, 4669-4680, 2021 | 3 | 2021 |
| Design optimization of copper patterns and location of power semiconductors and terminals Y Abe, A Hirao, R Kato, Y Ikeda, V Parque, MK Faiz, M Yoshida, ... 2021 International Conference on Electronics Packaging (ICEP), 157-158, 2021 | 3 | 2021 |
| On design optimization of heat sinks with curvature considerations for additive manufacturing Y Tateishi, H Gohara, R Kato, Y Ikeda, V Parque, T Miyashita, MK Faiz, ... EngOpt 2018 Proceedings of the 6th International Conference on Engineering …, 2019 | 3 | 2019 |
| Sn-Bi added Ag-based transient liquid phase sintering for low temperature bonding MK Faiz, T Yamamoto, M Yoshida 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | 3 | 2017 |
| Proposition of new yield criterion for green sand mold and its experimental validation by FEM stress analysis of triaxial compression test Y Okimura, Y Kato, H Makino, K Hashimoto, Y Maeda, T Okane, MK Faiz, ... Journal of Materials Processing Technology 318, 118020, 2023 | 2 | 2023 |
| Evaluation of Ejection Force for Die Castings by FEM Thermal Stress Analysis with Elasto-Plastic-Creep Model S Ueda, S Sannakanishi, H Shiga, MK Faiz, M Yoshida MATERIALS TRANSACTIONS 63 (2), 217-223, 2022 | 1 | 2022 |
| Relationships of design parameters and the cooling performance of the spiral-fin heatsink S Otake, M Hori, R Kato, Y Ikeda, V Parque, MK Faiz, M Yoshida, ... 2021 International Conference on Electronics Packaging (ICEP), 161-162, 2021 | 1 | 2021 |
| Measurement of viscous properties on Al-5mass% Mg alloy in semi-solid state by tensile test with high-frequency induction heating Y Nagata, R Onizawa, M Someya, H Kotaki, R Takai, M Ebata, T Okane, ... Keikinzoku/Journal of Japan Institute of Light Metals 71 (2), 112-120, 2021 | 1 | 2021 |
| Viscosity Properties Prediction of Semi-Solid Aluminum Alloys Using Finite Element Analysis Based on Quenched Solidified Structure, and Experimental Validation N Takatori, M Amano, R Miyachi, Y Nagata, MK Faiz, M Yoshida MATERIALS TRANSACTIONS 61 (12), 2371-2377, 2020 | 1 | 2020 |
| Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application MK Faiz, T Yamamoto, M Yoshida 2017 IEEE CPMT Symposium Japan (ICSJ), 195-198, 2017 | 1 | 2017 |
| Low Temperature and Low Pressure Bonding of Power Module and Copper Heat Spreader by Transient Liquid Phase Sintering KF Muhammad 早稲田大学, 2017 | 1 | 2017 |
| Analysis of partially pulsating fatigue process on carbon steel with microstructural observation H Shimano, MK Faiz, A Hara, K Yoshizumi, M Yoshida, S Horibe Materials Science and Engineering: A 651, 83-88, 2016 | 1 | 2016 |
| Experimental Construction and Validation of Revised Drucker–Prager Model Using Finite Element Method for Moisture Condensation Zone in Bentonite-Bonded Silica Sand Y Okimura, R Imamura, K Shimo, T Hanai, Y Kato, K Hashimoto, MK Faiz, ... Journal of Materials Engineering and Performance, 1-18, 2024 | | 2024 |
| Al-2% Si 合金 (7) 共晶凝固過程 (mt 苍 力学特性 G 及 (rTSr (7) 影響 R Hirano, S Ozaki, Y Nagata, A Matsushita, T Sakamoto, K Orio, ... Keikinzoku/Journal of Japan Institute of Light Metals 73 (9), 447-454, 2023 | | 2023 |
| Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering T Yamamoto, MK Faiz, T Suga, T Miyashita, M Yoshida 2017 IEEE CPMT Symposium Japan (ICSJ), 139-140, 2017 | | 2017 |
Tadatomo SugaMeisei UniversityVerified email at gakushikai.jp
