| Wettability of root canal sealers on intraradicular dentine treated with different irrigating solutions NV Ballal, A Tweeny, K Khechen, KN Prabhu, Satyanarayan, FR Tay Journal of dentistry 41 (6), 556-560, 2013 | 88 | 2013 |
| Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy Satyanarayan, KN Prabhu Advances in Colloid and Interface Science 166 (1-2), 87-118, 2011 | 77 | 2011 |
| A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications MC Kumaraswamy, Satyanarayan Journal of ELECTRONIC MATERIALS, 2019 | 70 | 2019 |
| Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature KN Prabhu, P Deshapande, Satyanarayan Materials Science and Engineering: A 533, 64-70, 2012 | 42 | 2012 |
| Welding of Sn and Cu plates using controlled underwater shock wave Satyanarayan, S Tanaka, A Mori, K Hokamoto Journal of Materials Processing Technology 245 (2017), 300-308, 2017 | 34 | 2017 |
| Underwater Shock Wave Weldability Window for Sn-Cu Plates Satyanarayan, A Mori, M Nishi, K Hokamoto Journal of Materials Processing Technology 267, 152-158, 2019 | 32* | 2019 |
| A review on metal-oxide based trace ammonia sensor for detection of renal disease by exhaled breath analysis SS Shetty, A Jayarama, S Bhat, Satyanarayan, I Karunasagar, R Pinto Materials Today: Proceedings 55, 113-117, 2022 | 14 | 2022 |
| Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates Satyanarayan, KN Prabhu Materials Science and Technology 27 (7), 1157-1162, 2011 | 14 | 2011 |
| Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds KN Bhat, KN Prabhu, Satyanarayan Journal of Materials Science: Materials in Electronics 25, 864-872, 2014 | 13 | 2014 |
| Spreading behavior and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substrates Satyanarayan, KN Prabhu Journal of electronic materials 42, 2696-2707, 2013 | 12 | 2013 |
| Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7 Cu solder alloy and copper substrate Satyanarayan, KN Prabhu Journal of Materials Science: Materials in Electronics 23, 1664-1672, 2012 | 11 | 2012 |
| Role of UV irradiated Nafion in power enhancement of hydrogen fuel cells P Castelino, A Jayarama, S Bhat, Satyanarayan, P Fernandes, S Prabhu, ... International Journal of Hydrogen Energy 46 (50), 25596-25607, 2021 | 10 | 2021 |
| Comparison of spreading behaviour and interfacial microstructure in Sn–0· 7Cu, Sn–0· 3Ag–0· 7Cu and Sn–2· 5Ag–0· 5Cu lead free solder alloys on Fe–42Ni substrate Satyanarayan, KN Prabhu Materials Science and Technology 29 (4), 464-473, 2013 | 7 | 2013 |
| Effect of purging gas on wetting behavior of Sn-3.5 Ag lead-free solder on nickel-coated aluminum substrate KN Prabhu, M Varun, Satyanarayan Journal of materials engineering and performance 22, 723-728, 2013 | 6 | 2013 |
| Wetting Behavior of Reactive and Non–Reactive Wetting of Liquids on Metallic Substrates P Bhagawath, KN Prabhu, Satyanarayan International Journal of Materials and Metallurgical Engineering 7 (1), 29-32, 2013 | 6 | 2013 |
| Reactive wetting of Sn–2.5 Ag–0.5 Cu solder on copper and silver coated copper substrates Satyanarayan, KN Prabhu Journal of Materials Science: Materials in Electronics 24, 1714-1719, 2013 | 5 | 2013 |
| Effect of surface treatment on wetting behavior of copper S Kalgudi, GP Pavithra, KN Prabhu, PG Koppad, CV Gowda, ... Materials Today: Proceedings 35 (3), 295-297, 2020 | 4 | 2020 |
| Wetting behavior of lead-free solders on copper substrates Satyanarayan, KN Prabhu IET Digital Library, 2013 | 4* | 2013 |
| Wetting Behavior and Evolution of Microstructure of Sn–3.5 Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates VU Nayak, KN Prabhu, N Stanford, Satyanarayan Transactions of the Indian Institute of Metals 65, 713-717, 2012 | 4 | 2012 |
| Study on thermal contact resistance of low melting alloy used as thermal interface material MCK Swamy, Satyanarayan, R Pinto Materials Today: Proceedings 66, 2508-2512, 2022 | 3 | 2022 |
K. NARAYAN PRABHUProfessor, Department of Metallurgical and Materials Engineering, NITKVerified email at nitk.edu.in
