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A. Shoji HallJohns Hopkins UniversityVerified email at jhu.edu
Zhuo KangUniversity of Science and Technology BeijingVerified email at ustb.edu.cn
Yue ZhangDepartment of Materials Science and Engineering, Beijing University of Science and TechnologyVerified email at ustb.edu.cn
Du SunShanghai Institute of Ceramics, Chinese Academy of ScienceVerified email at mail.sic.ac.cn
Yingzhi SunTesla | University of California, BerkeleyVerified email at berkeley.edu
Zhang Zhenguniversity of science and technology BeijingVerified email at ustb.edu.cn
Fufei ANPh.D, University of Illinois at Urbana | Senior Engineer @ Analog Devices IncVerified email at illinois.edu
Bernard GaskeyR&D Engineer at Los Alamos National LabVerified email at lanl.gov
Tim MuellerToyota Research InstituteVerified email at tri.global
Chuhong WangPh.D. Johns Hopkins UniversityVerified email at jhu.edu
Kenneth J. T. LiviDirector, Materials Characterization and Processing Center, Johns Hopkins UniversityVerified email at jhu.edu
Ruichun LuoUniversity of Chinese Academy of SciencesVerified email at ucas.ac.cn
Jia-Qi Huang (黄佳琦)Beijing Institute of TechnologyVerified email at bit.edu.cn
Qiang ZhangTsinghua UniversityVerified email at mails.tsinghua.edu.cn
Rui Xu(许睿)Beijing Institute of TechnologyVerified email at bit.edu.cn
Thomas J. KempaJohns Hopkins UniversityVerified email at jhu.edu
Zhenxing FengOregon State UniversityVerified email at oregonstate.edu
Ju Xue (薛琚)PhD Student at Johns Hopkins UniversityVerified email at jhu.edu
Tim WeihsProfessor of Materials Science and Engineering, Johns Hopkins UniversityVerified email at jhu.edu
Tianyao GongJohns Hokpins University, Columbia UniversityVerified email at jhu.edu