| Mitigation of electromigration in metal interconnects via hexagonal boron nitride as an Ångström‐thin passivation layer Y Jeong, O Douglas, U Misra, MRE Tanjil, K Watanabe, T Taniguchi, ... Advanced Electronic Materials 7 (6), 2100002, 2021 | 5 | 2021 |
| Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ć… ngstrƶ mā€ Thin Passivation Layer Y Jeong, O Douglas, U Misra, MR Tanjil, K Watanabe, T Taniguchi, ... Advanced Electronic Materials, 2021 | 5 | 2021 |
| Hexagonal Boron Nitride: Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer (Adv. Electron. Mater. 6/2021) Y Jeong, O Douglas, U Misra, MRE Tanjil, K Watanabe, T Taniguchi, ... Advanced Electronic Materials 7 (6), 2170020, 2021 | | 2021 |
| Top-Down Processing Towards Ångström-Thin Two-Dimensional (2D) Elemental Metals M Rubayat-E Tanjil, S Agbakansi, KP Suero, O Douglas, Y Jeong, Z Yin, ... International Manufacturing Science and Engineering Conference 84256 …, 2020 | | 2020 |
| Top-Down Processing Towards Ångström-Thin Two-Dimensional (2D) Elemental Metals RE Tanjil, S Agbakansi, KP Suero, O Douglas, Y Jeong, Z Yin, ... ASME 2020 15th International Manufacturing Science and Engineering Conference, 0 | | |
