| FinFET evolution toward stacked-nanowire FET for CMOS technology scaling P Zheng, D Connelly, F Ding, TJK Liu IEEE Transactions on Electron Devices 62 (12), 3945-3950, 2015 | 63 | 2015 |
| Analysis of 7/8-nm bulk-Si FinFET technologies for 6T-SRAM scaling X Zhang, D Connelly, P Zheng, H Takeuchi, M Hytha, RJ Mears, TJK Liu IEEE Transactions on Electron Devices 63 (4), 1502-1507, 2016 | 40 | 2016 |
| Simulation-based study of the inserted-oxide FinFET for future low-power system-on-chip applications P Zheng, D Connelly, F Ding, TJK Liu IEEE Electron Device Letters 36 (8), 742-744, 2015 | 38 | 2015 |
| Simulation-based study of hybrid fin/planar LDMOS design for FinFET-based system-on-chip technology YT Wu, F Ding, D Connelly, P Zheng, MH Chiang, JF Chen, TJK Liu IEEE Transactions on Electron Devices 64 (10), 4193-4199, 2017 | 28 | 2017 |
| Design-technology co-optimization of standard cell libraries on Intel 10nm process X Wang, R Kumar, SB Prakash, P Zheng, TH Wu, Q Shi, M Nabors, ... 2018 IEEE International Electron Devices Meeting (IEDM), 28.2. 1-28.2. 4, 2018 | 21 | 2018 |
| Variation-aware comparative study of 10-nm GAA versus FinFET 6-T SRAM performance and yield P Zheng, YB Liao, N Damrongplasit, MH Chiang, TJK Liu IEEE Transactions on Electron Devices 61 (12), 3949-3954, 2014 | 19 | 2014 |
| Channel stress and ballistic performance advantages of gate-all-around FETs and inserted-oxide FinFETs D Connelly, P Zheng, TJK Liu IEEE Transactions on Nanotechnology 16 (2), 209-216, 2017 | 15 | 2017 |
| Advanced MOSFET structures and processes for sub-7 nm CMOS technologies P Zheng UC Berkeley, 2016 | 15 | 2016 |
| Inserted-oxide FinFET (iFinFET) design to extend CMOS scaling P Zheng, D Connelly, F Ding, TJK Liu 2015 International Symposium on VLSI Technology, Systems and Applications, 1-2, 2015 | 12 | 2015 |
| Hydrogenation of graphene nanoribbon edges: Improvement in carrier transport P Zheng, SE Bryan, Y Yang, R Murali, A Naeemi, JD Meindl IEEE electron device letters 34 (5), 707-709, 2013 | 12 | 2013 |
| Sub-lithographic patterning via tilted ion implantation for scaling beyond the 7-nm technology node P Zheng, SW Kim, D Connelly, K Kato, F Ding, L Rubin, TJK Liu IEEE Transactions on Electron Devices 64 (1), 231-236, 2016 | 9 | 2016 |
| Tilted ion implantation as a cost-efficient sublithographic patterning technique SW Kim, P Zheng, K Kato, L Rubin, TJ King Liu Journal of Vacuum Science & Technology B 34 (4), 2016 | 9 | 2016 |
| Enhanced patterning by tilted ion implantation SW Kim, P Zheng, K Kato, L Rubin, TJK Liu Alternative Lithographic Technologies VIII 9777, 273-278, 2016 | 7 | 2016 |
| There's still plenty of room at the bottom—And at the Top TJK Liu, P Zheng, S Kim, K Kato, V Stojanovic 2017 75th Annual Device Research Conference (DRC), 1-2, 2017 | 4 | 2017 |
| Saponins from Panax japonicus alleviate adipose tissue fibrosis and metabolic dysfunction in high-fat-diet-induced obese mice X Hu, A Sun, H Chen, X Yan, F Ding, P Zheng, Z Li, Y Yan Biomarkers 27 (8), 784-794, 2022 | 3 | 2022 |
| Cell ratio tuning for high-density SRAM voltage scaling with inserted-oxide FinFETs F Ding, P Zheng, D Connelly, YT Wu, TJK Liu IEEE Electron Device Letters 37 (12), 1539-1542, 2016 | 3 | 2016 |
| Benefits of segmented Si/SiGe p-channel MOSFETs for analog/RF applications N Xu, B Ho, P Zheng, B Wood, V Tran, S Chopra, Y Kim, BY Nguyen, ... 2013 Symposium on VLSI Technology, T142-T143, 2013 | 3 | 2013 |
| Extending the Era of Moore’s Law Through Lower Cost Patterning P Zheng, L Rubin, TJK Liu Silicon Semiconductor 39, 32-36, 2017 | 2 | 2017 |
| Sustaining the silicon revolution: From 3-D transistors to 3-D integration TJK Liu, P Zheng, D Connelly, K Kato, R Nguyen, C Qian, A Peschot 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2015 | 2 | 2015 |
| Comparison of 10 nm GAA vs. FinFET 6-T SRAM performance and yield P Zheng, YB Liao, N Damrongplasit, MH Chiang, WC Hsu, TJK Liu 2014 Silicon Nanoelectronics Workshop (SNW), 1-2, 2014 | 2 | 2014 |
