| High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package A Inamdar, YH Yang, A Prisacaru, P Gromala, B Han Polymer Degradation and Stability 188, 109572, 2021 | 32 | 2021 |
| Study of thermal aging behavior of epoxy molding compound for applications in harsh environments A Inamdar, A Prisacaru, M Fleischman, E Franieck, P Gromala, A Veres, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 811-818, 2019 | 9 | 2019 |
| Towards a digital twin architecture for the lighting industry V Guerra, B Hamon, B Bataillou, A Inamdar, WD van Driel Future Generation Computer Systems, 2024 | 1 | 2024 |
| EMC Oxidation Under High-Temperature Aging A Inamdar, P Gromala, A Prisacaru, A Kabakchiev, Y Yang, B Han Reliability of Organic Compounds in Microelectronics and Optoelectronics …, 2022 | 1 | 2022 |
| ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components A Inamdar, T Hauck, M van Soestbergen, WD van Driel, GQ Zhang 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | | 2024 |
| A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound A Inamdar, M van Soestbergen, A Mavinkurve, W van Driel, GQ Zhang 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | | 2023 |
| Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation AS Inamdar, WD van Driel, K Zhang The 33rd European Safety and Reliability Conference (ESREL 2023): The Future …, 2023 | | 2023 |
| Degradation and Remaining Useful Life Prediction of Automotive Electronics P Gromala, A Inamdar, A Prisacaru, M Dressler, A Kabakchiev Reliability of Organic Compounds in Microelectronics and Optoelectronics …, 2022 | | 2022 |
| Design and Development of Low Cost Silicone Implant Used in Augmentation Rhinoplasty Suitable for the Indian Sub-continental Population A Inamdar, N Adhe, S Shende, R Uddanwadiker, S Lulay International Journal of Pharma Medicine and Biological Sciences 5 (1), 81, 2016 | | 2016 |
| Digital Twins for Electronics Packaging and Systems P Gromala, A Inamdar, W van Driel, GQ Zhang, C Bailey, L Nguyen, ... | | |
Przemyslaw GromalaRobert Bosch GmbHVerified email at de.bosch.com
