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Co-authors
- Shivang AgrawalUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Kiruba S. HaranUniversity of Illinois, Urbana-ChampaignVerified email at illinois.edu
- Wrichik BasuThe University of ManchesterVerified email at manchester.ac.uk
- Dhaval PatelOnsemi, Sunnyvale, USVerified email at onsemi.com
- Al-Thaddeus AvestruzUniversity of MichiganVerified email at umich.edu
- Dr. Ravindra BhideTechnology Development Project ManagerVerified email at ieee.org
- Shahriar KhushrushahiPost Doctoral Fellow, MITVerified email at alum.mit.edu
- Bogdan Kasztenny, Ph.D., D.Sc., IEEE...Protection Engineer, Schweitzer Engineering Laboratories, Inc.Verified email at selinc.com
- Harish PillaiDept of Electrical Engg, IIT BombayVerified email at ee.iitb.ac.in
- Peter LindahlExponent, Inc.Verified email at exponent.com
- Bhaskar SenPost-Doc Researcher, The University of SheffieldVerified email at sheffield.ac.uk
- William PremerlaniGE Aviation SystemsVerified email at ge.com