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Prasad Bhosale
Prasad Bhosale
Senior Process Technologist/Integration, Applied Materials
Verified email at uw.edu
Title
Cited by
Cited by
Year
Mechanically robust nanoparticle stabilized transparent liquid marbles
PS Bhosale, MV Panchagnula, HA Stretz
Applied Physics Letters 93 (3), 2008
1592008
On synthesizing solid polyelectrolyte microspheres from evaporating liquid marbles
PS Bhosale, MV Panchagnula
Langmuir 26 (13), 10745-10749, 2010
542010
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
T Nogami, X Zhang, J Kelly, B Briggs, H You, R Patlolla, H Huang, ...
2017 Symposium on VLSI Technology, T148-T149, 2017
252017
Sweating liquid micro-marbles: dropwise condensation on hydrophobic nanoparticulate materials
PS Bhosale, MV Panchagnula
Langmuir 28 (42), 14860-14866, 2012
252012
Electroacoustics of particles dispersed in polymer gel
PS Bhosale, J Chun, JC Berg
Langmuir 27 (12), 7376-7379, 2011
222011
Poly (acrylic acid) as a rheology modifier for dense alumina dispersions in high ionic strength environments
PS Bhosale, JC Berg
Colloids and surfaces A: physicochemical and engineering aspects 362 (1-3 …, 2010
212010
A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
T Zhou, NA Lanzillo, P Bhosale, D Gall, R Quon
Aip Advances 8 (5), 2018
182018
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
NA Lanzillo, OD Restrepo, PS Bhosale, E Cruz-Silva, CC Yang, ...
Applied Physics Letters 112 (16), 2018
182018
Acoustic spectroscopy of colloids dispersed in a polymer gel system
PS Bhosale, JC Berg
Langmuir 26 (18), 14423-14426, 2010
182010
Bottom electrode for MRAM applications
P Bhosale, RR Patlolla, M Rizzolo, CC Yang
US Patent 10,096,769, 2018
162018
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
T Nogami, R Patlolla, J Kelly, B Briggs, H Huang, J Demarest, J Li, ...
2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017
162017
Spin-dependent electron scattering in cobalt interconnects
NA Lanzillo, P Bhosale, C Lavoie, DJ Dechene, RR Robison, K Choi
Journal of Physics D: Applied Physics 52 (49), 495302, 2019
142019
Electrophoretic mobility of poly (acrylic acid)-coated alumina particles
PS Bhosale, J Chun, JC Berg
Journal of colloid and interface science 358 (1), 123-128, 2011
122011
The dynamics of polymer bridge formation and disruption and its effect on the bulk rheology of suspensions
PS Bhosale, JC Berg
Langmuir 28 (49), 16807-16811, 2012
112012
Area-selective deposition of tantalum nitride with polymerizable monolayers: from liquid to vapor phase inhibitors
K Lionti, N Arellano, N Lanzillo, S Nguyen, PS Bhosale, H Bui, T Topuria, ...
Chemistry of Materials 34 (7), 2919-2930, 2022
92022
Advanced BEOL interconnects
T Nogami, O Gluschenkov, Y Sulehria, S Nguyen, H Huang, NA Lanzillo, ...
2020 IEEE International Interconnect Technology Conference (IITC), 1-3, 2020
92020
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
T Nogami, H Huang, H Shobha, R Patlolla, J Kelly, C Penny, CK Hu, D Sil, ...
2019 Symposium on VLSI Technology, T18-T19, 2019
72019
Modified ALD TaN barrier with Ru liner and dynamic Cu reflow for 36nm pitch interconnect integration
PS Bhosale, J Maniscalco, N Lanzillo, T Nogami, D Canaperi, ...
2018 IEEE International Interconnect Technology Conference (IITC), 43-45, 2018
72018
Skip via for metal interconnects
HP Amanapu, P Bhosale, NV LiCausi, LW Liebmann, JJ McMahon, ...
US Patent 10,978,388, 2021
62021
Gold Nanoparticle Deposition Using CO2 Expanded Liquids: Effect of Pressure Oscillation and Surface−Particle Interactions
PS Bhosale, HA Stretz
Langmuir 24 (21), 12241-12246, 2008
62008
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Articles 1–20