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Larry K.B. LiHong Kong University of Science and TechnologyVerified email at ust.hk
Yu GuanHong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Minping WanProfessor, Southern University of Science and TechnologyVerified email at sustc.edu.cn
Yuanhang ZhuUniversity of Virginia, Brown UniversityVerified email at alumni.brown.edu
Minwoo LeeDepartment of Mechanical Engineering, Hanbat National UniversityVerified email at hanbat.ac.kr
Karthik KashinathPrincipal Scientist & Engineer, NVIDIAVerified email at nvidia.com
Dachuan FengDelft University of TechnologyVerified email at tudelft.nl
Bo YinThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Mohammad Hossein DoranehgardMechanical Engineering Department, Texas A&M University, USAVerified email at tamu.edu
Abhijit Kumar KushwahaKing Abdullah University of Science and TechnologyVerified email at connect.ust.hk
Prof. Matthew P. JuniperProfessor of Thermofluids Dynamics, University of CambridgeVerified email at cam.ac.uk
Anna YoungAssociate Professor, University of BathVerified email at bath.ac.uk
Kyu Tae KimKAISTVerified email at kaist.ac.kr
Stéphane RedonnetThe Hong Kong University of Science and TechnologyVerified email at ust.hk
Nagabhushana Rao VadlamaniIndian Institute of Technology MadrasVerified email at iitm.ac.in
Aditya VaidPhD Researcher, CNRS - LMFLVerified email at univ-lille.fr
Shiyi ChenProfessor, College of Engineering, EIT and SUSTechVerified email at sustech.edu.cn
Christian Oliver PaschereitHermann-Föttinger-Institut, TU BerlinVerified email at tu-berlin.de
Aditya SaurabhIndian Institute of Technology KanpurVerified email at iitk.ac.in
Lipika KabirajAssistant Professor, Mechanical Engineering, Indian Institute of Technology RoparVerified email at iitrpr.ac.in