| Adaptable hydrogel networks with reversible linkages for tissue engineering H Wang, SC Heilshorn Advanced Materials 27 (25), 3717-3736, 2015 | 688 | 2015 |
| Covalently Adaptable Elastin‐Like Protein–Hyaluronic Acid (ELP–HA) Hybrid Hydrogels with Secondary Thermoresponsive Crosslinking for Injectable Stem Cell Delivery H Wang, D Zhu, A Paul, L Cai, A Enejder, F Yang, SC Heilshorn Advanced Functional Materials 27 (28), 1605609, 2017 | 243 | 2017 |
| Elastin-like protein-hyaluronic acid (ELP-HA) hydrogels with decoupled mechanical and biochemical cues for cartilage regeneration D Zhu, H Wang, P Trinh, SC Heilshorn, F Yang Biomaterials 127, 132-140, 2017 | 205 | 2017 |
| An in Vivo miRNA Delivery System for Restoring Infarcted Myocardium H Yang, X Qin, H Wang, X Zhao, Y Liu, HT Wo, C Liu, M Nishiga, H Chen, ... ACS nano 13 (9), 9880-9894, 2019 | 114 | 2019 |
| Hybrid elastin-like polypeptide–polyethylene glycol (ELP-PEG) hydrogels with improved transparency and independent control of matrix mechanics and cell ligand density H Wang, L Cai, A Paul, A Enejder, SC Heilshorn Biomacromolecules 15 (9), 3421-3428, 2014 | 98 | 2014 |
| Photoacoustic Imaging of Embryonic Stem Cell‐Derived Cardiomyocytes in Living Hearts with Ultrasensitive Semiconducting Polymer Nanoparticles X Qin, H Chen, H Yang, H Wu, X Zhao, H Wang, T Chour, E Neofytou, ... Advanced Functional Materials 28 (1), 1704939, 2018 | 69 | 2018 |
| Engineered Matrices Enable the Culture of Human Patient‐Derived Intestinal Organoids DR Hunt, KC Klett, S Mascharak, H Wang, D Gong, J Lou, X Li, PC Cai, ... Advanced Science 8 (10), 2004705, 2021 | 50 | 2021 |
| Tunable control of hydrogel microstructure by kinetic competition between self-assembly and crosslinking of elastin-like proteins H Wang, A Paul, D Nguyen, A Enejder, SC Heilshorn ACS applied materials & interfaces 10 (26), 21808-21815, 2018 | 44 | 2018 |
| Adaptable Hydrogels: Adaptable Hydrogel Networks with Reversible Linkages for Tissue Engineering (Adv. Mater. 25/2015) H Wang, SC Heilshorn Advanced Materials 27 (25), 3710-3710, 2015 | 12 | 2015 |
| Low Temperature Atomic Layer Deposition Of Silicon Nitride H Wang, P Manna, B Qi, AB Mallick US Patent App. 16/397,155, 2019 | 6 | 2019 |
| 3D NAND etch S Jiang, P Manna, B Qi, AB Mallick, R Cheng, T Kitajima, HS Whitesell, ... US Patent 10,886,140, 2021 | 5 | 2021 |
| CONFORMAL SILICON-GERMANIUM FILM DEPOSITION H Wang, SS Roy, AB Mallick US Patent App. 16/953,569, 2022 | 1 | 2022 |
| Plasma cleaning methods for processing chambers H Wang, R KUSTRA, K ALAYAVALLI, E Venkatasubramanian, ... US Patent App. 16/896,575, 2021 | 1 | 2021 |
| Thermal deposition of silicon-germanium H Wang, SS Roy, AB Mallick US Patent 11,830,734, 2023 | | 2023 |
| Diffusion barriers for germanium H Wang, SS Roy, T Koshizawa, B Qi, AB Mallick, NK Ingle US Patent 11,791,155, 2023 | | 2023 |
| Defect free germanium oxide gap fill H Wang, SS Roy, T Koshizawa, B Qi, AB Mallick US Patent 11,781,218, 2023 | | 2023 |
| Non-conformal high selectivity film for etch critical dimension control B Qi, H Wang, Y Rao, AB Mallick US Patent 11,702,751, 2023 | | 2023 |
| 3D NAND etch S Jiang, P Manna, B Qi, AB Mallick, R Cheng, T Kitajima, HS Whitesell, ... US Patent 11,515,170, 2022 | | 2022 |
| Deposition of low-stress boron-containing layers H Wang, R Kustra, B Qi, AB Mallick, K Alayavalli, JD Pinson US Patent 11,495,454, 2022 | | 2022 |
| DEPOSITION OF LOW-STRESS CARBON-CONTAINING LAYERS H Wang, R Kustra, B Qi, AB Mallick, K Alayavalli, JD Pinson US Patent App. 17/847,454, 2022 | | 2022 |
