| Perspective: Optical measurement of feature dimensions and shapes by scatterometry AC Diebold, A Antonelli, N Keller Apl Materials 6 (5), 2018 | 51 | 2018 |
| Nonconventional applications of Mueller matrix-based scatterometry for advanced technology nodes D Dixit, N Keller, Y Lifshitz, T Kagalwala, A Elia, V Todi, J Fronheiser, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 17 (3), 034001-034001, 2018 | 22 | 2018 |
| Sensitivity analysis and line edge roughness determination of 28-nm pitch silicon fins using Mueller matrix spectroscopic ellipsometry-based optical critical dimension metrology D Dixit, S O’Mullane, S Sunkoju, A Gottipati, ER Hosler, V Kamineni, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 14 (3), 031208-031208, 2015 | 22 | 2015 |
| Optical critical dimension metrology for directed self-assembly assisted contact hole shrink D Dixit, A Green, ER Hosler, V Kamineni, ME Preil, N Keller, J Race, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (1), 014004-014004, 2016 | 20 | 2016 |
| Nondestructive characterization of nanoscale subsurface features fabricated by selective etching of multilayered nanowire test structures using Mueller matrix spectroscopic … M Korde, S Kal, C Alix, N Keller, GA Antonelli, A Mosden, AC Diebold Journal of Vacuum Science & Technology B 38 (2), 2020 | 16 | 2020 |
| Advanced applications of scatterometry based optical metrology D Dixit, N Keller, T Kagalwala, F Recchia, Y Lifshitz, A Elia, V Todi, ... Metrology, Inspection, and Process Control for Microlithography XXXI 10145 …, 2017 | 14 | 2017 |
| Enhancing one dimensional sensitivity with plasmonic coupling S O’Mullane, B Peterson, J Race, N Keller, AC Diebold Optics Express 22 (21), 26246-26253, 2014 | 13 | 2014 |
| Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes GA Antonelli, N Keller, T Ribaudo, FJ Wong, W Ming, H Ding, Z Chen, ... Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021 | 9 | 2021 |
| Mueller matrix spectroscopic ellipsometry based scatterometry simulations of Si and Si/SixGe1-x/Si/SixGe1-x/Si fins for sub-7nm node gate-all-around transistor metrology S Dey, A Diebold, N Keller, M Korde Metrology, Inspection, and Process Control for Microlithography XXXII 10585 …, 2018 | 9 | 2018 |
| Optical characterization of multi-NST nanowire test structures using Mueller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes M Korde, S Kal, C Pereira, N Keller, A Mosden, AC Diebold Metrology, Inspection, and Process Control for Microlithography XXXIII 10959 …, 2019 | 8 | 2019 |
| Modeling ellipsometric measurement of three-dimensional structures with rigorous coupled wave analysis and finite element method simulations S O’Mullane, N Keller, AC Diebold Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (4), 044003-044003, 2016 | 8 | 2016 |
| X-ray metrology of nanowire/nanosheet FETs for advanced technology nodes M Korde, RJ Kline, DF Sunday, N Keller, S Kal, C Alix, A Mosden, ... Metrology, Inspection, and Process Control for Microlithography XXXIV 11325 …, 2020 | 6 | 2020 |
| Characterization of overlay and tilt in advanced technology nodes using scatterometry D Dixit, S Dey, T Kagalwala, P Timoney, Y Ramnath, A Elia, N Paranjape, ... 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2019 | 6 | 2019 |
| Modeling ellipsometric measurement of novel 3D structures with RCWA and FEM simulations S O'Mullane, N Keller, AC Diebold Metrology, Inspection, and Process Control for Microlithography XXX 9778, 41-50, 2016 | 5 | 2016 |
| Silicon fin line edge roughness determination and sensitivity analysis by Mueller matrix spectroscopic ellipsometry based scatterometry D Dixit, S O'Mullane, S Sunkoju, ER Hosler, V Kamineni, M Preil, N Keller, ... Metrology, Inspection, and Process Control for Microlithography XXIX 9424 …, 2015 | 4 | 2015 |
| Novel inline on-device measurement of silicon nitride lateral recess post channel hole ACI with IRCD metrology N Keller, W Ming, Z Chen, GA Antonelli, T Ribaudo, Z Liu, S Takabayashi, ... Metrology, Inspection, and Process Control XXXVI 12053, 270-278, 2022 | 3 | 2022 |
| Enhancing one dimensional sensitivity with plasmonic coupling: erratum S O’Mullane, B Peterson, J Race, N Keller, AC Diebold Optics Express 24 (4), 3613-3614, 2016 | 2 | 2016 |
| Optical CD metrology for directed self-assembly assisted contact hole shrink process D Dixit, ER Hosler, M Preil, N Keller, J Race, JS Chun, M O’Sullivan, ... Metrology, Inspection, and Process Control for Microlithography XXIX 9424 …, 2015 | 2 | 2015 |
| 3D NAND Oxide/Nitride Tier Stack Thickness Measurements with Infrared Metrology Y Wang, Z Chen, C Wang, N Keller, GA Antonelli, Z Liu, T Ribaudo, ... 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2023 | 1 | 2023 |
| Decorrelation of optical critical dimensions in mid-infrared ellipsometric spectroscopy of high aspect ratio etch profiles A Fumani, B Yan, N Keller, GA Antonelli, T Ribaudo Journal of Micro/Nanopatterning, Materials, and Metrology 21 (2), 021205-021205, 2022 | 1 | 2022 |
