| 340-GHz low-cost and high-gain on-chip higher order mode dielectric resonator antenna for THz applications CH Li, TY Chiu IEEE Transactions on Terahertz Science and Technology 7 (3), 284-294, 2017 | 107 | 2017 |
| A 340-GHz heterodyne receiver front end in 40-nm CMOS for THz biomedical imaging applications CH Li, CL Ko, MC Kuo, DC Chang IEEE transactions on terahertz science and technology 6 (4), 625-636, 2016 | 69 | 2016 |
| A 1.2-V 5.2-mW 20–30-GHz Wideband Receiver Front-End in 0.18-um CMOS CH Li, CN Kuo, MC Kuo IEEE 60 (11), 3502-3512, 2012 | 68* | 2012 |
| A compact 0.9-/2.6-GHz dual-band RF energy harvester using SiP technique CH Li, MC Yu, HJ Lin IEEE Microwave and Wireless Components Letters 27 (7), 666-668, 2017 | 47 | 2017 |
| A 210-GHz amplifier in 40-nm digital CMOS technology CL Ko, CH Li, CN Kuo, MC Kuo, DC Chang IEEE transactions on microwave theory and techniques 61 (6), 2438-2446, 2013 | 44 | 2013 |
| A 37.5-mW 8-dBm-EIRP 15.5-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration CH Li, TY Chao, CW Lai, WC Chen, CL Ko, CN Kuo, YT Cheng, MC Kuo, ... IEEE Transactions on Microwave Theory and Techniques 63 (2), 470-480, 2015 | 36 | 2015 |
| A 0.6-V 0.33-mW 5.5-GHz receiver front-end using resonator coupling technique CH Li, YL Liu, CN Kuo IEEE transactions on microwave theory and techniques 59 (6), 1629-1638, 2011 | 32 | 2011 |
| A 340 GHz triple-push oscillator with differential output in 40 nm CMOS CH Li, CL Ko, CN Kuo, MC Kuo, DC Chang IEEE Microwave and Wireless Components Letters 24 (12), 863-865, 2014 | 31 | 2014 |
| Single flip-chip packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement CH Li, TY Chiu IEEE Access 7, 7737-7746, 2019 | 25 | 2019 |
| A low-cost DC-to-84-GHz broadband bondwire interconnect for SoP heterogeneous system integration CH Li, CL Ko, CN Kuo, MC Kuo, DC Chang IEEE transactions on microwave theory and techniques 61 (12), 4345-4352, 2013 | 23 | 2013 |
| A flip-chip-assembled W-band receiver in 90-nm CMOS and IPD technologies CH Li, WT Hsieh, TY Chiu IEEE Transactions on Microwave Theory and Techniques 67 (4), 1628-1639, 2019 | 22 | 2019 |
| A 147 GHz fully differential D-band amplifier design in 65-nm CMOS CNK Chun-Hsing Li, Chih-Wei Lai Asia-Pacific Microw. Conf. (APMC, 2013 | 20 | 2013 |
| An interconnecting technology for RF MEMS heterogeneous chip integration TY Chao, CH Li, YC Chen, HY Chen, YT Cheng, CN Kuo IEEE transactions on electron devices 57 (4), 928-938, 2010 | 18 | 2010 |
| A balunless frequency multiplier with differential output by current flow manipulation CH Li, WM Wu IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (7 …, 2018 | 16 | 2018 |
| Low-loss low-cost substrate-integrated waveguide and filter in GaAs IPD technology for terahertz applications TY Chiu, CH Li IEEE Access 9, 86346-86357, 2021 | 15 | 2021 |
| A low-cost broadband bondwire interconnect for heterogeneous system integration CH Li, CL Ko, CN Kuo, MC Kuo, DC Chang 2013 IEEE MTT-S International Microwave Symposium Digest (MTT), 1-4, 2013 | 13 | 2013 |
| Constant loss contours of matching networks for millimeter-wave LNA design CL Ko, CH Li, MC Kuo, DC Chang IEEE Microwave and Wireless Components Letters 26 (11), 939-941, 2016 | 10 | 2016 |
| Low-loss single-band, dual-band, and broadband mm-wave and (sub-) THz interconnects for THz SoP heterogeneous system integration CH Li, TY Chiu IEEE transactions on terahertz science and technology 12 (2), 130-143, 2021 | 9 | 2021 |
| A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications TY Chiu, C Wang, WT Hsieh, HJ Lin, TY Lin, R Liu, DC Chang, CH Li 2017 IEEE International Symposium on Radio-Frequency Integration Technology …, 2017 | 9 | 2017 |
| Broadband connection structure and method CH Li, CN Kuo US Patent 9,450,650, 2016 | 9 | 2016 |
