| Distribution des communautés végétales sous l'influence des lisières forestières dans des bois fragmentés A Alignier | 35* | 2010 |
| Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules C Scognamillo, AP Catalano, P Lasserre, C Duchesne, V d'Alessandro, ... Microelectronics Reliability 114, 113742, 2020 | 19 | 2020 |
| Contribution to the stress grading in integrated power modules C Duchesne, T Lebey, M Mermet-Guyennet, E Dutarde, S Dagdag 2007 European Conference on Power Electronics and Applications, 1-9, 2007 | 9 | 2007 |
| Laser transmission welding as an assembling process for high temperature electronic packaging M Villar, F Chabert, C Garnier, V Nassiet, JC Diez, A Sotelo, MA Madre, ... 2016 International Conference on Electrical Systems for Aircraft, Railway …, 2016 | 8 | 2016 |
| Technologie d’interconnexions par bumps pour semi-conducteurs de puissance P Lasserre, C Duchesne, E Batista 14ème Édition de la Conférence Electronique de Puissance du Futur, 2012 | 5 | 2012 |
| Contribution à l'étude de la gradation de potentiel dans les modules de puissance haute tension C Duchesne Université de Toulouse, Université Toulouse III-Paul Sabatier, 2009 | 5 | 2009 |
| IMS-based integrated SiC-MOSFET bidirectional switches for advanced CSI implementation Y Lee, S Avilès, C Duchesne, P Lasserre, A Castellazzi 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE …, 2023 | 4 | 2023 |
| SiC MOSFET bi-directional switch IMS module design Y Lee, A Castellazzi, S Avilès, C Duchesne, P Lasserre 2023 35th International Symposium on Power Semiconductor Devices and ICs …, 2023 | 3 | 2023 |
| Stress grading in integrated power modules C Duchesne, M Mermet-Guyennet, E Dutarde, T Lebey, S Dagdag 2007 7th Internatonal Conference on Power Electronics, 347-351, 2007 | 2 | 2007 |
| Interconnection Technology for 10 kV SiC Power Module C Duchesne, J Tarrieu, P Lasserre PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 1 | 2019 |
| Interconnection technology for new wide band gap semiconductors D Cyrille, C Philippe, C Xavier 2013 15th European Conference on Power Electronics and Applications (EPE), 1-10, 2013 | 1 | 2013 |
| Brazing failure of inner power modules' interconnects using scattering parameter characterization A Gopishetti, S Baffreau, PE Vidal, C Duchesne, TL Long Microelectronics Reliability 150, 115116, 2023 | | 2023 |
| Reliable development of an IMS-based SiC power module Y Lee, S Avilès, S Fukunaga, C Duchesne, P Lasserre, A Castellazzi, ... Microelectronics Reliability 150, 115164, 2023 | | 2023 |
| Optimum module design III: electromagnetic C Duchesne, P Lasserre, E Batista SiC Power Module Design: Performance, Robustness and Reliability 151, 133, 2021 | | 2021 |
| Anatomy of a multi-chip power module C Duchesne, P Lasserre, E Batista SiC Power Module Design: Performance, Robustness and Reliability 151, 23, 2021 | | 2021 |
| FilSiC–De l'épitaxie au module de puissance P Cussac, C Duchesne, JB Fonder, D Tournier, P Brosselard, G Grosset, ... Symposium de Génie Electrique (SGE'16), 2016 | | 2016 |
| ESARS-ITEC 2016 International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference U Abronzini, E Agostini Jr, M Akdere, T Akiba, M Alakula, M Alaküla, ... | | |
