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Prashant K Kulshreshtha
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Highly etch selective amorphous carbon film
S Bobek, PK KULSHRESHTHA, R Prasad, KD Lee, H Whitesell, H Oshio, ...
US Patent 10,727,059, 2020
2072020
Direct observation of mineral–organic composite formation reveals occlusion mechanism
K Rae Cho, YY Kim, P Yang, W Cai, H Pan, AN Kulak, JL Lau, ...
Nature communications 7 (1), 10187, 2016
1182016
Nano-indentation: A tool to investigate crack propagation related phase transitions in PV silicon
PK Kulshreshtha, KM Youssef, G Rozgonyi
Solar energy materials and solar cells 96, 166-172, 2012
332012
Method and apparatus for clamping and declamping substrates using electrostatic chucks
ZJ Ye, H Hanawa, JC Rocha-Alvarez, P Manna, MW Tsiang, KO Allen, ...
US Patent App. 15/370,682, 2017
292017
Ultra-high modulus and etch selectivity boron-carbon hardmask films
PK Kulshreshtha, D Ziqing, KT Narasimha, KD Lee, BH Kim
US Patent 10,418,243, 2019
282019
Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system
ZJ Ye, IIJD Pinson, H Hanawa, J Zhou, X Lin, RG Duan, KD Lee, BH Kim, ...
US Patent 10,403,535, 2019
232019
Cleaning process for removing boron-carbon residuals in processing chamber at high temperature
F Bi, PK Kulshreshtha, KD Lee, P Connors
US Patent 10,679,830, 2020
152020
Effect of nickel contamination on high carrier lifetime n-type crystalline silicon
Y Yoon, B Paudyal, J Kim, YW Ok, P Kulshreshtha, S Johnston, ...
Journal of Applied Physics 111 (3), 2012
142012
Harnessing entropic and enthalpic contributions to create a negative tone chemically amplified molecular resist for high-resolution lithography
PK Kulshreshtha, K Maruyama, S Kiani, J Blackwell, DL Olynick, ...
Nanotechnology 25 (31), 315301, 2014
122014
Oxygen precipitation related stress-modified crack propagation in high growth rate Czochralski silicon wafers
PK Kulshreshtha, YH Yoon, KM Youssef, EA Good, G Rozgonyi
Journal of the Electrochemical Society 159 (2), H125, 2011
122011
Sub-20nm lithography negative tone chemically amplified resists using cross-linker additives
PK Kulshreshtha, K Maruyama, S Kiani, S Dhuey, P Perera, J Blackwell, ...
Advances in Resist Materials and Processing Technology XXX 8682, 162-171, 2013
112013
Silicon PV Wafers: Mechanical strength and correlations with defects and stress
GA Rozgonyi, KM Youssef, P Kulshreshtha, M Shi, E Good
Solid State Phenomena 178, 79-87, 2011
112011
Gas flow profile modulated control of overlay in plasma CVD films
PK Kulshreshtha, S Rathi, S Basu, KD Lee, MJ Seamons, BH Kim, ...
US Patent 9,390,910, 2016
102016
The effects of different types of additives on growth of biomineral phases investigated by in situ atomic force microscopy
KR Cho, P Kulshreshtha, KJJ Wu, J Seto, SR Qiu, JJ De Yoreo
Journal of Crystal Growth 509, 8-16, 2019
82019
Mechanistic pathways for the molecular step growth of calcium oxalate monohydrate crystal revealed by in situ liquid-phase atomic force microscopy
KR Cho, JH Lee, HS Seo, Y Ji, JH Park, SE Lee, HW Kim, KJJ Wu, ...
ACS Applied Materials & Interfaces 13 (31), 37873-37882, 2021
72021
Cleaning process for cleaning amorphous carbon deposition residuals using low rf bias frequency applications
P Manna, PK Kulshreshtha, KD Lee, MJ Seamons, AB Mallick, BH Kim, ...
US Patent App. 14/619,138, 2015
72015
Gas flow profile modulated control of overlay in plasma CVD films
PK Kulshreshtha, S Rathi, S Basu, KD Lee, MJ Seamons, BH Kim, ...
US Patent 10,373,822, 2019
62019
Selective laser ablation in resists and block copolymers for high resolution lithographic patterning
DL Olynick, P Perera, A Schwartzberg, P Kulshreshta, DG De Oteyza, ...
Journal of Photopolymer Science and Technology 28 (5), 663-668, 2015
52015
Nanoscale modulus and surface chemistry characterization for collapse free resists
PK Kulshreshtha, K Maruyama, S Kiani, D Ziegler, J Blackwell, D Olynick, ...
Metrology, Inspection, and Process Control for Microlithography XXVII 8681 …, 2013
52013
Highly etch selective amorphous carbon film
R Prasad, S Bobek, PK Kulshreshtha, KD Lee, H Whitesell, H Oshio, ...
US Patent 11,469,107, 2022
32022
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