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- Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Soumyadip SettAssistant Professor, Indian Institute of Technology GandhinagarVerified email at iitgn.ac.in
- Xiao Yan (颜笑)Chongqing UniversityVerified email at cqu.edu.cn
- Moonkyung KimStaff Engineer at Samsung Electronics Device Solutions Semiconductor R&D CenterVerified email at illinois.edu
- Shreyas ChavanGraduate Student, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAVerified email at hanyang.ac.kr
- Longnan LiChangchun Institute of Optics Fine Mechanics and Physics, Chinese Academy of Sciences; UIUCVerified email at ciomp.ac.cn
- Daniel OrejonSenior Lecturer Chemical Engineering, Institute Multiacale Thermofluids, The University of EdinburghVerified email at ed.ac.uk
- Jingcheng MaIncoming Assistant Professor at the University of Notre DameVerified email at nd.edu
- Evelyn N WangMechanical Engineering, MITVerified email at mit.edu
- Yasuyuki TakataKyushu UniversityVerified email at mech.kyushu-u.ac.jp
- Ryan EnrightSeguente, Nokia Bell Labs, MIT, University of LimerickVerified email at seguente.tech
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Hyeongyun Cha
University at Buffalo, The State University of New York
Verified email at buffalo.edu - Homepage