Road traffic accidents: An overview of data sources, analysis techniques and contributing factors A Chand, S Jayesh, AB Bhasi Materials Today: Proceedings 47, 5135-5141, 2021 | 70 | 2021 |
Analysing the covid-19 cases in kerala: a visual exploratory data analysis approach S Sreedharan SN Comprehensive Clinical Medicine 2 (9), 1337-1348, 2020 | 18 | 2020 |
Experimental investigation on the effect of Ag addition on ternary lead free solder alloy–Sn–0.5 Cu–3Bi S Jayesh, J Elias Metals and Materials International 26, 107-114, 2020 | 15 | 2020 |
Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy− Sn-1Cu-1Ni-1Ag S Jayesh, J Elias International Journal for Simulation and Multidisciplinary Design …, 2019 | 14 | 2019 |
Experimental investigations on the effect of addition of Ag into ternary lead free solder alloy Sn-1Cu-1Ni JE Jayesh S Letters on Materials 9 (2), 239-242, 2019 | 9 | 2019 |
Investigations on the properties of new lead free solder alloy composition–Sn-0.5 Cu-3.5 Bi S Jayesh, J Elias Materials Today: Proceedings 21, 329-331, 2020 | 8 | 2020 |
Synthesis and characterisation of graphene-reinforced AA 2014 MMC using squeeze casting method for lightweight aerospace structural applications A Pazhani, M Venkatraman, MA Xavior, A Moganraj, A Batako, ... Materials & Design 230, 111990, 2023 | 6 | 2023 |
Identification and recovery of rare earth elements from electronic waste: Material characterization and recovery strategies, 2023 J Bhavan, J Joy, A Pazhami | 4 | 2023 |
Experimental and finite element analysis on determining the fatigue life of pb-free solder joint (Sn-0.5 Cu-3Bi-1Ag) used in electronic packages under harmonic loads S Jayesh, J Elias International Journal of Modeling, Simulation, and Scientific Computing 11 …, 2020 | 3 | 2020 |
Investigations on the Corrosion Properties of Sn–0.5 Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution S Jayesh, J Elias Transactions on Electrical and Electronic Materials 22 (2), 150-159, 2021 | 2 | 2021 |
Experimental Investigations on Impact Toughness and Shear Strength of Lead Free Solder Alloy Sn–0.5 Cu–3Bi–xAg S Jayesh, J Elias Transactions on Electrical and Electronic Materials 21 (2), 191-197, 2020 | 2 | 2020 |
Investigations on the Corrosion Properties of Sn–1Cu–1Ni–xAg Lead Free Solders in 3.5% NaCl Solution S Jayesh, J Elias Protection of Metals and Physical Chemistry of Surfaces 57, 858-865, 2021 | 1 | 2021 |
Covid-19 Cases in India: A Visual Exploratory Data Analysis Model S Jayesh, S Sreedharan medRxiv, 2020.09. 11.20193029, 2020 | 1 | 2020 |
Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni S Jayesh, J Elias, M Guru International Journal for Simulation and Multidisciplinary Design …, 2020 | 1 | 2020 |
An experimental investigation on the properties of two novel ternary solder alloys Sn–0.5 Cu–3Bi and Sn–1Cu–1Ni replacing lead S Jayesh, E Jacob Physics of Metals and Metallography 120, 1398-1403, 2019 | 1 | 2019 |
EBSD Characterization of Graphene Nano Sheet reinforced Sn-Ag solder alloy composites JS Bhavan, A Pazhani, PS Robi, A Ambi, TG Unnikrishnan, KC Vishnu Journal of Materials Research and Technology, 2024 | | 2024 |
Design, Development, and Performance Evaluation of a Lightweight Short Shifter for Enhanced Gear-Shifting Quality in Automobile L Kartanas, J Shanthi Bhavan Journal of The Institution of Engineers (India): Series D, 1-11, 2023 | | 2023 |
Lead Free Solder Alloy for Moderately High Temperature Applications JE Jayesh S IN Patent 402,398, 2022 | | 2022 |
An experimental investigation on design, characterization and analysis of two novel lead free solder alloys S Jayesh, J Elias Cochin University of Science and Technology, 2020 | | 2020 |
Cost-Benefit Analysis of Sn-0.5 Cu-3Bi-1Ag and Sn-1Cu-1Ni-1Ag Lead Free Solder Alloys Considering Elemental Cost, Hardness, Contact Angle and Melting Temperatures S Jayesh, J Elias, S Asif Emerging Technologies for Sustainability: Proceedings of the Annual …, 2020 | | 2020 |