Effect of Joule Heating on electromigration in dual-damascene copper low-k interconnects KD Lee, J Kim, TY Jeong, Y Zhao, Q Yuan, A Patel, ZT Mai, LH Brown, ... 2017 IEEE International Reliability Physics Symposium (IRPS), 6B-6.1-6B-6.5, 2017 | 18 | 2017 |
System and method for haze control in semiconductor processes X Chen, M Nguyen, O Arasaki, T Maraquin, D Sawyer, P Morrison US Patent 7,486,391, 2009 | 9 | 2009 |
Haze defect control and containment in a high volume DRAM manufacturing environment JX Chen, M Nguyen, O Arasaki, T Maraquin, D Sawyer, P Morrison 25th Annual BACUS Symposium on Photomask Technology 5992, 1022-1032, 2005 | 2 | 2005 |
Interconnect structure formed with a high aspect ratio single damascene copper line on a non-damascene via KD Lee, D Sawyer, S English US Patent 10,211,093, 2019 | 1 | 2019 |
Method for post removal including concrete footing removal D Sawyer US Patent 8,250,787, 2012 | | 2012 |
Bioorganic & Medicinal Chemistry, Vol. 3, No. 10, p. v, 1995 Elsevier Science Ltd Printed in Great Britain KH Kim, A Lau, KH Lee, MT Le Goff, A Llobet, T Matsuda, L Mayol, ... | | |