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Keng-Hua Lin
Keng-Hua Lin
Materials Engineering, Purdue University
Verified email at intel.com
Title
Cited by
Cited by
Year
Thermal transport in SiGe superlattice thin films and nanowires: Effects of specimen and periodic lengths
KH Lin, A Strachan
Physical Review B 87 (11), 115302, 2013
682013
Mesodynamics with implicit degrees of freedom
KH Lin, BL Holian, TC Germann, A Strachan
The Journal of Chemical Physics 141, 064107, 2014
222014
Effects of Cold-Rolling/Aging Treatments on the Shape Memory Properties of Ti49.3Ni50.7 Shape Memory Alloy
SH Chang, KH Lin, SK Wu
Materials 10 (7), 704, 2017
112017
Role of direct electron-phonon coupling across metal-semiconductor interfaces in thermal transport via molecular dynamics
KH Lin, A Strachan
The Journal of Chemical Physics 143 (3), 2015
112015
Limit for thermal transport reduction in Si nanowires with nanoengineered corrugations
SE Sullivan, KH Lin, S Avdoshenko, A Strachan
Applied Physics Letters 103 (24), 2013
82013
Molecular dynamics simulations of PMMA slabs: role of annealing conditions
Y Kim, KH Lin, A Strachan
Modelling and Simulation in Materials Science and Engineering 21 (6), 065010, 2013
52013
nanoMATERIALS nanoscale heat transport
KH Lin, S Sullivan, MJ Cherukara, A Strachan, T Feng, X Ruan, B Qiu
42014
Two-stage martensitic transformation in thermal-cycled Ti40. 5Ni49. 5Hf10 shape memory alloy
TJ Ho, SK Wu, KH Lin
Materials transactions 51 (4), 679-684, 2010
22010
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