| Reliability and failure mechanism of solder joints in thermal cycling tests B Arfaei, S Mahin-Shirazi, S Joshi, M Anselm, P Borgesen, E Cotts, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 976-985, 2013 | 50 | 2013 |
| Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure B Arfaei, L Wentlent, S Joshi, A Alazzam, T Tashtoush, M Halaweh, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 40 | 2012 |
| LGAs vs. BGAs–lower profile and better reliability S Joshi, B Arfaei, A Singh, M Gharaibeh, M Obaidat, A Alazzam, ... Proc. SMTAI, 47-57, 2012 | 25 | 2012 |
| Effect of Sn grain morphology on failure mechanism and reliability of lead-free solder joints in thermal cycling tests B Arfaei, M Anselm, S Joshi, S Mahin-Shirazi, P Borgesen, E Cotts, ... SMTA Int, 539-550, 2013 | 17 | 2013 |
| Controlling the superior reliability of lead free assemblies with short standoff height through design and materials selection B Arfaei, L Wentlent, S Joshi, M Anselm, P Borgesen ASME International Mechanical Engineering Congress and Exposition 45257, 467-473, 2012 | 15 | 2012 |
| Strength and isothermal fatigue resistance of SnBi/SnAgCu joints reflowed at low temperatures M Yadav, T Alghoul, S Thekkut, R Das, C Greene, P Borgesen, ... Journal of Electronic Packaging 144 (3), 031001, 2022 | 9 | 2022 |
| Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits V Kasi, A Zareei, S Gopalakrishnan, AM Alcaraz, S Joshi, B Arfaei, ... Advanced Electronic Materials 9 (4), 2201012, 2023 | 7 | 2023 |
| K. Mori, and T. Shirai,“Improving Thermal Cycle Reliability and Mechanical Drop Impact resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of … T Wada, S Tsuchiya, S Joshi, R Garcia Proceedings of IPC APEX, 14-16, 2017 | 5 | 2017 |
| Solder Paste and Flux Technology S Joshi, P Borgesen Lead‐free Soldering Process Development and Reliability, 73-93, 2020 | 4 | 2020 |
| Superior thermal cycling reliability of Pb-free solder alloy by addition of indium and bismuth for harsh environments T Wada, K Mori, S Joshi, R Garcia Proceedings of SMTA International, 210-215, 2016 | 3 | 2016 |
| Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free Solder Alloys T Pearson, R Coyle, M Osterman, F Hadian, D Hillman, C Johnson, ... Proceedings of SMTAI International, 2022 | 1 | 2022 |
| Early transient creep of single crystal SnAgCu solder joints R Das, S Thekkut, RS Sivasubramony, T Alghoul, A Mahmood, S Joshi, ... Journal of Materials Science: Materials in Electronics 33 (17), 13657-13667, 2022 | 1 | 2022 |
| Manufacturing Plant Location Selection: A Case Study with Resilient Strategy Using AHP X Zhang, Y Zong, R Das, S Joshi, A Alzu’Bi, N Nagarur | 1 | 2021 |
| A mechanistic model for the life of solder joints under realistic long-term service conditions P Borgesen, L Wentlent, T Alghoul, S Joshi, R Sivasubramony, M Yadav, ... 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 1 | 2018 |
| Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive T Wada, S Tsuchiya, S Joshi, R Garcia, K Mori, T Shirai Proceedings of IPC Apex Expo, 2017 | 1 | 2017 |
| An investigation into lead-free low silver cored solder wire for electronics manufacturing applications S Joshi, J Bath, K Mori, K Yukikata, R Garcia, T Shirai IPC APEX Conference, 2017 | 1 | 2017 |
| HEM (HYBRID ENSEMBLE MODEL): A NOVEL LEARNINGAPPROACH MS Yadav, SM Joshi, S Bharodia Harbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology 54 (10 …, 2022 | | 2022 |
| Kissing aneurysms at anterior communicating artery: report of an extremely rare case GR Sharma, B Vaidhya, S Joshi Nepal Med Coll J 17 (3-4), 182-184, 2015 | | 2015 |
| On controlling and correlating microstructure of pb-free solder joints to reliability under accelerated loading conditions SM Joshi State University of New York at Binghamton, 2013 | | 2013 |
| A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys R Coyle, D Hillman, T Pearson, M Osterman, J Smetana, K Howell, J Silk, ... | | |
Peter BorgesenProfessor of Systems Science & Industrial Engineering, Binghamton UniversityVerified email at binghamton.edu
