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Kaspar Jansen
Kaspar Jansen
Full professor TU Delft
Verified email at tudelft.nl
Title
Cited by
Cited by
Year
Fabrication factors influencing mechanical, moisture-and water-related properties of mycelium-based composites
FVW Appels, S Camere, M Montalti, E Karana, KMB Jansen, ...
Materials & Design 161, 64-71, 2019
3452019
Effect of processing conditions on shrinkage in injection molding
KMB Jansen, DJ Van Dijk, MH Husselman
Polymer Engineering & Science 38 (5), 838-846, 1998
2581998
Effect of pressure history on shrinkage and residual stresses—injection molding with constrained shrinkage
KMB Jansen, G Titomanlio
Polymer Engineering & Science 36 (15), 2029-2040, 1996
1711996
Droplet breakup in concentrated emulsions
KMB Jansen, WGM Agterof, J Mellema
Journal of rheology 45 (1), 227-236, 2001
1452001
In‐mold shrinkage and stress prediction in injection molding
G Titomanlio, KMB Jansen
Polymer Engineering & Science 36 (15), 2041-2049, 1996
1291996
Hydrophobin gene deletion and environmental growth conditions impact mechanical properties of mycelium by affecting the density of the material
FVW Appels, J Dijksterhuis, CE Lukasiewicz, KMB Jansen, HAB Wösten, ...
Scientific reports 8 (1), 4703, 2018
1252018
Construction of fast‐response heating elements for injection molding applications
KMB Jansen, AAM Flaman
Polymer Engineering & Science 34 (11), 894-897, 1994
1061994
As‐molded shrinkage measurements on polystyrene injection molded products
KMB Jansen, R Pantani, G Titomanlio
Polymer Engineering & Science 38 (2), 254-264, 1998
991998
Heat transfer in injection moulding systems with insulation layers and heating elements
KMB Jansen
International Journal of heat and mass transfer 38 (2), 309-316, 1995
951995
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang
Optical Materials 35 (3), 504-508, 2013
892013
4D printing of reconfigurable metamaterials and devices
T van Manen, S Janbaz, KMB Jansen, AA Zadpoor
Communications Materials 2 (1), 56, 2021
792021
Closed form expression for residual stresses and warpage during cure of composite laminates
M Abouhamzeh, J Sinke, KMB Jansen, R Benedictus
Composite Structures 133, 902-910, 2015
752015
Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound
M Sadeghinia, KMB Jansen, LJ Ernst
International Journal of Adhesion and Adhesives 32, 82-88, 2012
752012
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang
Microelectronics Reliability 54 (1), 138-142, 2014
592014
Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding
M Akram, KMB Jansen, LJ Ernst, S Bhowmik
International journal of adhesion and adhesives 31 (7), 598-604, 2011
562011
Numerical modeling of warpage induced in QFN array molding process
DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ...
Microelectronics Reliability 47 (2-3), 310-318, 2007
542007
Characterization of the viscoelastic properties of an epoxy molding compound during cure
M Sadeghinia, KMB Jansen, LJ Ernst
Microelectronics Reliability 52 (8), 1711-1718, 2012
532012
Constitutive modeling of moulding compounds [electronic packaging applications]
KMB Jansen, L Wang, DG Yang, C Van't Hof, LJ Ernst, HJL Bressers, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
532004
Time-and temperature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses
LJ Ernst, GQ Zhang, KMB Jansen, HJL Bressers
J. Electron. Packag. 125 (4), 539-548, 2003
512003
Correlation between chemistry of polymer building blocks and microelectronics reliability
HJL Bressers, WD van Driel, KMB Jansen, LJ Ernst, GQ Zhang
Microelectronics Reliability 47 (2-3), 290-294, 2007
502007
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Articles 1–20