| Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates HR Kotadia, O Mokhtari, MP Clode, MA Green, SH Mannan Journal of Alloys and Compounds 511 (1), 176-188, 2012 | 126 | 2012 |
| Correlation between microstructure and mechanical properties of Sn–Bi–X solders O Mokhtari, H Nishikawa Materials Science and Engineering: A 651, 831-839, 2016 | 118 | 2016 |
| Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging S Zhou, O Mokhtari, MG Rafique, VC Shunmugasamy, B Mansoor, ... Journal of Alloys and Compounds 765, 1243-1252, 2018 | 68 | 2018 |
| A review: Formation of voids in solder joint during the transient liquid phase bonding process-Causes and solutions O Mokhtari Microelectronics Reliability 98, 95-105, 2019 | 64 | 2019 |
| Transient liquid phase bonding of Sn–Bi solder with added Cu particles O Mokhtari, H Nishikawa Journal of materials science: materials in electronics 27, 4232-4244, 2016 | 62 | 2016 |
| Effects of In and Ni addition on microstructure of Sn-58Bi solder joint O Mokhtari, H Nishikawa Journal of electronic materials 43, 4158-4170, 2014 | 61 | 2014 |
| Reactions of Sn-3.5 Ag-based solders containing Zn and Al additions on Cu and Ni (P) substrates HR Kotadia, O Mokhtari, M Bottrill, MP Clode, MA Green, SH Mannan Journal of electronic materials 39, 2720-2731, 2010 | 59 | 2010 |
| Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy S Zhou, C Yang, S Lin, AN AlHazaa, O Mokhtari, X Liu, H Nishikawa Materials Science and Engineering: A 744, 560-569, 2019 | 49 | 2019 |
| The shear strength of transient liquid phase bonded Sn–Bi solder joint with added Cu particles O Mokhtari, H Nishikawa advanced powder technology 27 (3), 1000-1005, 2016 | 45 | 2016 |
| Die-attach bonding for high temperature applications using thermal decomposition of copper (II) formate with polyethylene glycol SK Bhogaraju, O Mokhtari, F Conti, G Elger Scripta Materialia 182, 74-80, 2020 | 29 | 2020 |
| Disabling of nanoparticle effects at increased temperature in nanocomposite solders O Mokhtari, A Roshanghias, R Ashayer, HR Kotadia, F Khomamizadeh, ... Journal of electronic materials 41, 1907-1914, 2012 | 28 | 2012 |
| Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction HR Kotadia, A Panneerselvam, O Mokhtari, MA Green, SH Mannan Journal of Applied Physics 111 (7), 2012 | 25 | 2012 |
| Cross-section preparation for solder joints and MEMS device using argon ion beam milling OM Amirmajdi, R Ashyer-Soltani, MP Clode, SH Mannan, Y Wang, ... IEEE transactions on electronics packaging manufacturing 32 (4), 265-271, 2009 | 21 | 2009 |
| Microstructure and mechanical properties of Sn–1.0 Ag–0.5 Cu solder with minor Zn additions YM Leong, A Haseeb, H Nishikawa, O Mokhtari Journal of Materials Science: Materials in Electronics 30, 11914-11922, 2019 | 19 | 2019 |
| Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor F Conti, A Hanss, O Mokhtari, SK Bhogaraju, G Elger New Journal of Chemistry 42 (23), 19232-19236, 2018 | 18 | 2018 |
| Effect of Zn addition on interfacial reactions between Sn-Bi solder and Cu substrate O Mokhtari, S Zhou, C YC, H Nishikawa Materials Transactions 57 (8), 1272-1276, 2016 | 16 | 2016 |
| Investigation of formation and growth behavior of Cu/Al intermetallic compounds during isothermal aging O Mokhtari, MS Kim, H Nishikawa, F Kawashiro, S Itoh, T Maeda, T Hirose, ... Transactions of The Japan Institute of Electronics Packaging 7 (1), 1-7, 2014 | 11 | 2014 |
| Corrosion and leaching behaviours of Sn-0.7 Cu-0.05 Ni lead-free solder in 3.5 wt.% NaCl solution JEC Guerrero, DH Camacho, O Mokhtari, H Nishikawa International Journal of Corrosion 2018, 2018 | 10 | 2018 |
| Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor O Mokhtari, F Conti, SK Bhogaraju, M Meier, H Schweigart, U Tetzlaff, ... New Journal of Chemistry 43 (26), 10227-10231, 2019 | 9 | 2019 |
| Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging SK Bhogaraju, O Mokhtari, J Pascucci, A Hanss, M Schmid, F Conti, ... 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 7 | 2019 |
